Patent Assignment
Reel/Frame 067974/0157
Assignment of Assignor's Interest
Recorded: 2024-07-12
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Stacked Device Structures and Methods for Forming the Same
Application:
18/771,031 →
Publication:
US 2024/0363631