Patent Assignment
Reel/Frame 068207/0957
Assignment of Assignor's Interest
Recorded: 2024-08-07
Pages: 4
Assignee
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2, AGRATE BRIANZA, 20864, ITALY
Covered Property
(1)
Lead-Frame Package Utilizing Integrated Insulating Layer for Integrated Circuit Insulation
Application:
18/796,554 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.