IP Library Assignment 068244/0047
Patent Assignment
Reel/Frame 068244/0047

Assignment of Assignor's Interest

Recorded: 2024-08-09 Pages: 3
Assignor
DEPETRO, RICCARDO
Executed: 2024-07-09
Assignee
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2, AGRATE BRIANZA, 20864, ITALY
Covered Property (1)
Semiconductor Electronic Device Integrating an Electronic Component Based on Heterostructure and Having Reduced Mechanical Stress
Application: 18/776,141 →
Publication: US 2025/0040210
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 17, 2024
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 069180/0793 →