IP Library › Assignment 068265/0557
Patent Assignment
Reel/Frame 068265/0557

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2024-08-13 Received: 2024-08-13 Pages: 4
Assignors
TAKAHASHI, AKIRA
Executed: 2024-06-05
KASHIMURA, TAKASHI
Executed: 2024-06-06
OHIRA, YUTAKA
Executed: 2024-06-06
OIWA, MAKO
Executed: 2024-06-06
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TX, 75001, UNITED STATES
Covered Applications (2)
THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT ASSEMBLIES AND METHODS FOR FORMING THE SAME
App. No. 18/784,263
→
THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT ASSEMBLIES AND METHODS FOR FORMING THE SAME
App. No. 63/656,468
→