Patent Assignment
Reel/Frame 068745/0597
Assignment of Assignor's Interest
Recorded: 2024-09-30
Pages: 4
Assignee
STMICROELECTRONICS APPLICATION GMBH
BAHNHOFSTRASSE 18, ASCHHEIM-DORNACH, 85609, GERMANY
Covered Property
(1)
Destressing Structure for Semiconductor Packages and Method of Manufacturing the Same
Application:
18/679,248 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.