Assignment of Assignor's Interest

Recorded: 2024-10-03 Pages: 2

Assignor

PSEMI CORPORATION

Executed: 2024-03-28

Assignee

MURATA MANUFACTURING CO., LTD.

10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO, 617-8555, JAPAN

Covered Property (1)

Multi-Die-To-Wafer Hybrid Bonding

Application: 18/888,811 →

Publication: US 2025/0015029

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.