Patent Assignment
Reel/Frame 069446/0556
Assignment of Assignor's Interest
Recorded: 2024-12-02
Received: 2024-12-02
Pages: 7
Assignors
VODRAHALLI, NAGESH
Executed: 2024-11-11
CHIN, HENRY
Executed: 2024-11-25
HU, CHENGQING
Executed: 2024-11-25
Assignee
SANDISK TECHNOLOGIES, INC.
951 SANDISK DRIVE, MILPITAS, CA, 95035, UNITED STATES
Covered Property
(1)
Self-Aligned Die-to-Wafer Bonding Architecture
Application:
18/963,996 →