IP Library › Assignment 069475/0942
Patent Assignment
Reel/Frame 069475/0942

Corrective Assignment to Correct the Correct the Second Assignee's Name in the Original Cover Sheet Previously Recorded at Reel: 69157 Frame: 937. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2024-12-03 Pages: 7
Assignors
HAN, DEOK SU
Executed: 2024-11-01
CHO, JONG YOUNG
Executed: 2024-10-29
KIM, WOO JOO
Executed: 2024-10-29
KANG, HYUN GOO
Executed: 2024-10-29
LEE, DONG KYUN
Executed: 2024-10-29
Assignees
SK ENPULSE CO., LTD.
1043, GYEONGGI-DAERO, GYEONGGI-DO, PYEONGTAEK-SI, 17784, KOREA, REPUBLIC OF
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUP, GYEONGGI-DO, ICHEON-SI, 17336, KOREA, REPUBLIC OF
Covered Property (1)
Polishing Composition for Semiconductor Process and Manufacturing Method of Substrate Using the Same
Application: 18/938,878 →
Publication: US 2025/0145860
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 6, 2024
From: HAN, DEOK SU; CHO, JONG YOUNG; KIM, WOO JOO; KANG, HYUN GOO
To: SK ENPULSE CO., LTD.; SK HYNIC INC.
Reel/Frame 069157/0937 →
Assignment of Assignor's Interest Mar 12, 2026
From: SK ENPULSE CO., LTD.
To: YCCHEM CO., LTD.
Reel/Frame 074058/0710 →