Patent Assignment
Reel/Frame 069500/0887
Assignment of Assignor's Interest
Recorded: 2024-12-05
Received: 2024-12-05
Pages: 3
Assignors
SHAO, QING
Executed: 2024-11-22
TOTOKI, YUJI
Executed: 2024-11-22
TOYAMA, FUMIAKI
Executed: 2024-11-22
LI, GUANGYUAN
Executed: 2024-11-24
Assignee
SANDISK TECHNOLOGIES, INC.
951 SANDISK DRIVE, MILPITAS, CA, 95035, UNITED STATES
Covered Property
(1)
Die-To-Wafer Bonded Memory Structures and Methods of Making the Same
Application:
18/959,002 →