IP Library Assignment 069501/0757
Patent Assignment
Reel/Frame 069501/0757

Assignment of Assignor's Interest

Recorded: 2024-12-05 Received: 2024-12-05 Pages: 6
Assignors
LI, GUANGYUAN
Executed: 2024-11-22
SHAO, QING
Executed: 2024-11-22
TOTOKI, YUJI
Executed: 2024-11-22
TOYAMA, FUMIAKI
Executed: 2024-11-22
HOU, LIN
Executed: 2024-11-25
Assignee
SANDISK TECHNOLOGIES, INC.
951 SANDISK DRIVE, MILPITAS, CA, 95035, UNITED STATES
Covered Property (1)
Die-To-Wafer Bonded Memory Structures and Methods of Making the Same
Application: 18/959,099 →