Assignment of Assignor's Interest

Recorded: 2024-12-10 Pages: 8

Assignors

TSENG, ANSHIH

Executed: 2023-12-21

ZOU, PENG

Executed: 2024-01-05

DIBENE, JOSEPH

Executed: 2024-01-23

WILLIAMS, GERARD

Executed: 2024-07-23

Assignee

QUALCOMM INCORPORATED

5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714

Covered Property (1)

Wafer Level Packaging Process for Thin Film Inductors

Application: 18/531,488 →

Publication: US 2024/0258364