IP Library › Assignment 070175/0787
Patent Assignment
Reel/Frame 070175/0787

Assignment of Assignor's Interest

Recorded: 2025-02-11 Pages: 7
Assignor
HODUL, JOHN N.
Executed: 2025-01-31
Assignee
LAIRD TECHNOLOGIES, INC.
16401 SWINGLEY RIDGE ROAD, SUITE 700, CHESTERFIELD, MISSOURI, 63017
Covered Property (1)
Controlling Bond Line Thickness (BLT) for Metal Amalgams
Application: 63/552,988 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 12, 2025
From: WEMP, CLAIRE K.
To: LAIRD TECHNOLOGIES, INC.
Reel/Frame 070197/0047 →
Assignment of Assignor's Interest Mar 6, 2025
From: WEMP, CLAIRE K.; HODUL, JOHN N.; STRADER, JASON L.
To: LAIRD TECHNOLOGIES, INC.
Reel/Frame 070430/0242 →