IP Library › Assignment 070406/0442
Patent Assignment
Reel/Frame 070406/0442

Assignment of Assignor's Interest

Recorded: 2025-03-05 Pages: 3
Assignors
WU, XIAODAN
Executed: 2023-11-06
STROTHERS, SUSAN D.
Executed: 2023-11-06
MOHANTY, RASHMI
Executed: 2023-11-06
MEYER, WAYNE
Executed: 2023-11-06
Assignee
HONEYWELL INTERNATIONAL INC.
855 S. MINT STREET, CHARLOTTE, NORTH CAROLINA, 28202
Covered Property (1)
Diffusion Bonded Tungsten Containing Target to Copper Alloy Backing Plate
Application: 18/531,641 →
Publication: US 2024/0229225
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jan 12, 2026
From: SOLSTICE ADVANCED MATERIALS US, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 074569/0260 →
Nunc Pro Tunc Assignment Apr 13, 2026
From: HONEYWELL INTERNATIONAL INC.
To: SOLSTICE ADVANCED MATERIALS US, INC.
Reel/Frame 074350/0321 →