IP Library › Assignment 070467/0155
Patent Assignment
Reel/Frame 070467/0155

Change of Name

Recorded: 2025-03-10 Pages: 4
Assignor
XCELSIS CORPORATION
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Transistor Level Interconnection Methodologies Utilizing 3D Interconnects
Application: 19/072,935 →
Publication: US 2025/0204006
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 10, 2025
From: DELACRUZ, JAVIER A.; FISCH, DAVID EDWARD
To: XCELSIS CORPORATION
Reel/Frame 070461/0882 →
Patent Security Agreement Supplement Jul 24, 2025
From: ADEIA SEMICONDUCTOR INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 072281/0565 →