Patent Assignment
Reel/Frame 070631/0978
Assignment of Assignor's Interest
Recorded: 2025-03-26
Pages: 8
Assignors
PUHURCUOGLU, NIHAL
Executed: 2024-10-02
PEDRAMASL, NIMA
Executed: 2024-10-03
AYDOGAN, BERKAY
Executed: 2024-10-02
TOPUZ, ILKER
Executed: 2024-10-02
Assignee
TPI TECHNOLOGY, INC.
8501 N. SCOTTSDALE ROAD, SCOTTSDALE, ARIZONA, 85253
Covered Property
(1)
Digital Three Dimensional (3D) Measurement of Bondline Thickness and Width During Blade Assembly
Application:
18/950,448 →
Publication:
US 2025/0162263