IP Library Assignment 070658/0987
Patent Assignment
Reel/Frame 070658/0987

Assignment of Assignor's Interest

Recorded: 2025-03-28 Pages: 3
Assignors
WENG, TONG-MIN
Executed: 2017-09-14
WU, TSUNG-HAN
Executed: 2017-09-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Properties (2)
Method for Forming Semiconductor Device and Resulting Device
Application: 16/673,794 →
Publication: US 2020/0066601
Method for Forming Semiconductor Device and Resulting Device
Application: 18/113,516 →
Publication: US 2023/0207395