Patent Assignment
Reel/Frame 070658/0987
Assignment of Assignor's Interest
Recorded: 2025-03-28
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Properties
(2)
Method for Forming Semiconductor Device and Resulting Device
Method for Forming Semiconductor Device and Resulting Device