Assignment of Assignor's Interest

Recorded: 2025-04-29 Pages: 3

Assignors

TANAKA, HIROYUKI

Executed: 2025-03-03

HOSODA, NAOHIRO

Executed: 2025-03-03

TSUTSUMI, MASANORI

Executed: 2025-03-03

Assignee

SANDISK TECHNOLOGIES, INC.

951 SANDISK DRIVE, MILPITAS, CALIFORNIA, 95035

Covered Property (1)

Three-Dimensional Memory Device with Through-Stack Contact via Structures and Methods for Forming the Same

Application: 19/068,885 →

Publication: US 2025/0386503

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.