Patent Assignment
Reel/Frame 071164/0784
Assignment of Assignor's Interest
Recorded: 2025-05-20
Pages: 4
Assignors
DELACRUZ, JAVIER A.
Executed: 2017-10-27
TEIG, STEVEN L.
Executed: 2017-10-27
HUANG, SHAOWU
Executed: 2017-10-27
PLANTS, WILLIAM C.
Executed: 2017-10-27
FISCH, DAVID EDWARD
Executed: 2017-10-26
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Direct-Bonded Native Interconnects and Active Base Die
Application:
19/176,612 →
Publication:
US 2026/0060048
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 20, 2025
From: XCELSIS CORPORATION
To: ADEIA SEMICONDUCTOR INC.
Reel/Frame 071296/0495 →
Assignment of Assignor's Interest
May 20, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: XCELSIS CORPORATION
Reel/Frame 072089/0916 →
Patent Security Agreement Supplement
Jul 24, 2025
From: ADEIA SEMICONDUCTOR INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 072281/0565 →