Patent Assignment
Reel/Frame 071378/0940
Assignment of Assignor's Interest
Recorded: 2025-06-10
Pages: 7
Assignors
CHEW, CHEE HIONG
Executed: 2019-07-31
PRAJUCKAMOL, ATAPOL
Executed: 2019-07-31
ST. GERMAIN, STEPHEN
Executed: 2019-07-31
LIN, YUSHENG
Executed: 2019-07-30
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, ATTN: IP LEGAL DEPT, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Low Stress Asymmetric Dual Side Module
Application:
19/234,107 →
Publication:
US 2025/0309199