Patent Assignment
Reel/Frame 071775/0961
Assignment of Assignor's Interest
Recorded: 2025-07-21
Pages: 6
Assignors
IM, SEUNGWON
Executed: 2020-12-17
KANG, DONGWOOK
Executed: 2020-12-17
JEON, OSEOB
Executed: 2020-12-17
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Integration of Semiconductor Device Assemblies with Thermal Dissipation Mechanisms
Application:
19/275,087 →
Publication:
US 2025/0349662