Assignment of Assignor's Interest

Recorded: 2025-08-20 Pages: 3

Assignors

TEIG, STEVEN L.

Executed: 2019-01-08

MOHAMMED, ILYAS

Executed: 2019-01-08

DUONG, KENNETH

Executed: 2019-01-08

DELACRUZ, JAVIER

Executed: 2019-01-08

Assignee

XCELSIS CORPORATION

3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134

Covered Property (1)

3D Processor Having Stacked Integrated Circuit Die

Application: 19/286,011 →

Publication: US US20260206646A1

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.