Patent Assignment
Reel/Frame 072124/0286
Assignment of Assignor's Interest
Recorded: 2025-08-26
Pages: 5
Assignor
STMICROELECTRONICS FRANCE
Executed: 2024-10-23
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, PLAN-LES-OUATES, GENEVA, 1228, SWITZERLAND
Covered Property
(1)
Hybrid Built-in System Test Switching Circuitry for Embedded Memory Testing
Application:
19/293,485 →
Publication:
US 2026/0066023
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 26, 2025
From: VERMA, PRAVEEN KUMAR; DHORI, KEDAR JANARDAN; RAWAT, HARSH; VADERIYA, YAGNESH DINESHBHAI
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 072123/0712 →
Assignment of Assignor's Interest
Aug 26, 2025
From: FAEHN, ERIC; LECOCQ, CHRISTOPHE
To: STMICROELECTRONICS FRANCE
Reel/Frame 072123/0949 →
Assignment of Assignor's Interest
Aug 26, 2025
From: ESCALLIER, CEDRIC
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 072124/0062 →
Assignment of Assignor's Interest
Aug 26, 2025
From: STMICROELECTRONICS (GRENOBLE 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 072124/0380 →