Assignment of Assignor's Interest

Recorded: 2025-09-15 Pages: 4

Assignors

TONG, HO-MING

Executed: 2023-10-20

LU, CHAO-CHUN

Executed: 2025-09-12

Assignees

ND-HI TECHNOLOGIES LAB, INC.

2F-2, NO. 22, LN. 35, JIHU RD., NEIHU DIST.,, TAIPEI CITY, 114754, TAIWAN

ETRON TECHNOLOGY, INC.

NO. 6, TECHNOLOGY ROAD 5, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN

Covered Property (1)

Semiconductor Package and Semiconductor Package Assembly with Edge Side Interconnection and Method of Forming the Same

Application: 18/471,670 →

Publication: US 2024/0128208