Patent Assignment
Reel/Frame 072601/0285
Assignment of Assignor's Interest
Recorded: 2025-10-20
Pages: 11
Assignors
VADHAVKAR, SAMEER S.
Executed: 2014-07-09
LI, XIAO
Executed: 2014-07-09
GROOTHUIS, STEVEN K.
Executed: 2014-07-11
LI, JIAN
Executed: 2014-07-09
GANDHI, JASPREET S.
Executed: 2014-07-09
DERDERIAN, JAMES M.
Executed: 2014-07-09
HEMBREE, DAVID R.
Executed: 2014-07-09
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Methods of Manufacturing Stacked Semiconductor Die Assemblies with High Efficiency Thermal Paths
Application:
18/454,703 →
Publication:
US 2023/0395463