Patent Assignment
Reel/Frame 072921/0274
Assignment of Assignor's Interest
Recorded: 2025-11-17
Pages: 10
Assignors
IM, SEUNGWON
Executed: 2023-03-28
JEON, OSEOB
Executed: 2023-04-03
KANG, DONGWOOK
Executed: 2023-03-28
KO, YOUNGSUN
Executed: 2023-03-28
KIM, JEUNGDAE
Executed: 2023-03-28
YUN, CHANGSUN
Executed: 2023-03-28
KIM, JIHWAN
Executed: 2023-04-04
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Transfer Molded Power Modules and Methods of Manufacture
Application:
19/390,797 →
Publication:
US 2026/0074448