Assignment of Assignor's Interest

Recorded: 2025-12-23 Pages: 4

Assignors

AOKI, YUKIKA

Executed: 2025-11-27

ARAI, YOSHIKAZU

Executed: 2025-11-17

AOKI, YU

Executed: 2025-11-17

Assignee

RESONAC CORPORATION

9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN

Covered Property (1)

Positive Photosensitive Resin Composition, Insulating Resin Film, Method for Forming Insulating Resin Film, and Semiconductor Device

Application: 19/487,604 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.