Assignment of Assignor's Interest

Recorded: 2026-07-08 Pages: 3

Assignor

MCGOFF, JAMES

Executed: 2026-07-08

Assignee

TEMPERPACK TECHNOLOGIES, INC.

4101 CAROLINA AVENUE, RICHMOND, VIRGINIA, 23222

Covered Property (1)

Void Fill Packaging Product and Methods for Making

Application: 18/719,568 →

Publication: US 2025/0051077

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.