IC structure including TSV having metal resistant to high temperatures and method of forming same
View Patent ↗An integrated circuit (IC) structure including: a first layer including a first plurality of active devices in a first semiconductor layer over a substrate; a first wiring layer over the first layer; a second layer including a second plurality of active devices within a second semiconductor layer over the first wiring layer; and a second wiring layer over the second layer, wherein the first wiring layer and the second wiring layer each including a first metal resistant to high temperature.
1. An integrated circuit (IC) structure, comprising:
a first layer including a first plurality of active devices in a first semiconductor layer over a substrate;
a first wiring layer over the first layer;
a second layer including a second plurality of active devices within a second semiconductor layer over the first wiring layer; and
a second wiring layer over the second layer, wherein the first wiring layer and the second wiring layer each includes a first metal having a melting point greater than approximately 1400 degrees Celsius (° C.).
2. The IC structure of claim 1 , further comprising:
a back-end-of-the-line (BEOL) metallization over the second wiring layer;
a first through silicon via (TSV) extending from the BEOL metallization to the first wiring layer; and
a second TSV extending from the BEOL metallization to the second wiring layer.
3. The IC structure of claim 2 , wherein the first TSV and the second TSV are in a staggered formation with respect to each other.
4. The IC structure of claim 2 , wherein the first TSV and the second TSV each includes copper.
5. The IC structure of claim 1 , further comprising:
an insulator layer over the first wiring layer and a crystalline silicon layer over the insulator layer below the second wiring layer.
6. The IC structure of claim 1 , wherein the first plurality of active devices is staggered with respect to the second plurality of active devices.
7. The IC structure of claim 1 , wherein the first metal includes at least one of: tungsten, cobalt, rhodium, iridium, nickel, ruthenium, tantalum, niobium, graphite, or platinum.
8. The IC structure of claim 1 , further comprising:
a first plurality of vias within the first layer, each via of the first plurality of vias connecting a portion of a respective active device of the first plurality of active devices to the first wiring layer; and
a second plurality of vias within the second layer, each via of the second plurality of vias connecting a portion of a respective active device of the second plurality of active devices to the second wiring layer,
wherein each via of the first plurality of vias and the second plurality of vias includes a second metal having a melting point greater than approximately 1400° C.
9. The IC structure of claim 8 , wherein the second metal resistant to high temperature includes at least one of: tungsten, cobalt, rhodium, iridium, nickel, ruthenium, tantalum, niobium, graphite, or platinum.
10. An integrated circuit (IC) structure, comprising:
a first layer including a first plurality of active devices in a first semiconductor layer over a substrate;
a first wiring layer over the first layer including a first metal resistant to high temperature;
a second layer including a second plurality of active devices within a second semiconductor layer over the first wiring layer;
a second wiring layer over the second layer including the first metal having a melting point greater than approximately 1400 degrees Celsius (° C.),
wherein the first metal resistant to high temperature includes at least one of: tungsten, cobalt, rhodium, iridium, nickel, ruthenium, tantalum, niobium, graphite, or platinum;
a back-end-of-the-line (BEOL) metallization over the second wiring layer;
a first through silicon via (TSV) extending from the BEOL metallization to the first wiring layer; and
a second TSV extending from the BEOL metallization to the second wiring layer.
11. The IC structure of claim 10 , wherein the first TSV and the second TSV each includes copper.
12. The IC structure of claim 10 , further comprising:
a first insulator layer over the first wiring layer and below the second wiring layer;
a first crystalline silicon layer between the first insulator layer and the second wiring layer;
a second insulator layer over the second wiring layer and below the BEOL metallization; and
a second crystalline silicon layer between the second insulator layer and the BEOL metallization.
13. The IC structure of claim 10 , wherein the first plurality of active devices is staggered with respect to the second plurality of active devices.