Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware

1. A test probe cleaning material for cleaning the contact elements and support structures of testing interfaces used for wafer level or package level IC semiconductor device functional testing, the cleaning material comprising:

a cleaning pad layer;

one or more intermediate layers underneath the cleaning pad layer, the one or more intermediate layers supporting the cleaning pad layer and having a set of predetermined characteristics of the one or more intermediate layers, the set of predetermined characteristics including a modulus of elasticity has a range between more than 40-MPa to 600-MPa, each layer has a thickness between 25-um and 300-um and each layer has a hardness between 30 Shore A and 90 Shore A; and

wherein the one or more intermediate layers further comprises a plurality of abrasive particles spatially distributed entirely within the one or more intermediate layers having a Mohs Hardness of 7 or greater that configure the cleaning material for contact elements and support structures of testing interfaces.

2. The cleaning material of claim 1 , wherein the one or more intermediate layers further comprises one or more compliant layers.

3. The cleaning material of claim 1 , wherein the one or more intermediate layers further comprises one or more rigid layers.

4. The cleaning material of claim 1 , wherein the one or more intermediate layers further comprises at least one rigid layer and at least one compliant layer.

5. The cleaning material of claim 1 , wherein the one or more intermediate layers provide one or more of an abrasiveness, a specific gravity, an elasticity, tackiness, planarity, thickness and a porosity.

6. The cleaning material of claim 5 , wherein the cleaning pad layer provides one or more of an abrasiveness, a specific gravity, an elasticity, tackiness, planarity, thickness and a porosity.

7. The cleaning material of claim 2 , wherein each compliant layer is made of one or more of rubbers, synthetic polymers and natural polymers with a porosity within a range from 10 to 150 micropores per inch.

8. The cleaning material of claim 3 , wherein each rigid layer is made of one or more of rubbers, synthetic polymers and natural polymers with a porosity within a range from 10 to 150 micropores per inch.

9. The cleaning material of claim 1 , wherein the plurality of abrasive particles further comprises one or more kinds of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond.

10. The cleaning material of claim 1 , wherein the plurality of abrasive particles further comprises a blend of one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond.