Low resistance current spreading to n-contacts of micro-LED array

1. A light source comprising:

an epitaxial layer stack including an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer, the epitaxial layer stack including a two-dimensional (2-D) array of mesa structures formed therein;

an array of p-contacts electrically coupled to the p-type semiconductor layer of the 2-D array of mesa structures;

a metal layer surrounding each individual mesa structure of the 2-D array of mesa structures; and

a plurality of n-contacts coupling the metal layer to the n-type semiconductor layer at a plurality of locations between the individual mesa structures of the 2-D array of mesa structures.

2. The light source of claim 1 , wherein the plurality of n-contacts and the array of p-contacts are on a same side of the n-type semiconductor layer or are on opposite sides of the n-type semiconductor layer.

3. The light source of claim 1 , further comprising an elongated n-contact at an area outside of the 2-D array of mesa structures, the elongated n-contact coupling the metal layer to the n-type semiconductor layer at the area outside of the 2-D array of mesa structures.

4. The light source of claim 1 , further comprising an array of micro-lenses on a surface of the n-type semiconductor layer.

5. The light source of claim 4 , wherein the array of micro-lenses is formed in the n-type semiconductor layer or a dielectric layer formed on the n-type semiconductor layer.

6. The light source of claim 4 , wherein the metal layer is between individual micro-lenses of the array of micro-lenses.

7. The light source of claim 1 , wherein the metal layer is on sidewalls of the 2-D array of mesa structures and regions between the 2-D array of mesa structures.

8. The light source of claim 7 , further comprising a dielectric layer between the sidewalls of the 2-D array of mesa structures and the metal layer, wherein the dielectric layer and the metal layer form a sidewall reflector.

9. The light source of claim 1 , further comprising a transparent conductive material layer between the array of p-contacts and the p-type semiconductor layer.

10. The light source of claim 1 , wherein each n-contact of the plurality of n-contacts is located at a center of a square region including four mesa structures.

11. The light source of claim 1 , wherein:

a pitch of the 2-D array of mesa structures is equal to or less than 5 μm; and

each mesa structure of the 2-D array of mesa structures is characterized by a lateral linear dimension equal to or less than 3 μm.

12. The light source of claim 1 , further comprising a second metal layer on a surface of the n-type semiconductor layer, wherein the metal layer and the second metal layer are on opposite sides of the n-type semiconductor layer.

13. The light source of claim 12 , wherein the second metal layer is configured to absorb visible light.

14. The light source of claim 1 , wherein the metal layer is characterized by at least one of:

a thickness greater than 50 nm; or

a drive current density equal to or greater than 1 A/cm 2 at a drive voltage equal to or less than 4.5 V.

15. The light source of claim 1 , wherein the metal layer includes Al, Au, Ni, Ti, Pd, Ge, Ag, Cu, or any combination thereof.

16. The light source of claim 1 , wherein at least one of the metal layer or the plurality of n-contacts is configured to absorb visible light.

17. The light source of claim 1 , wherein the n-type semiconductor layer includes a heavily doped sublayer.

18. The light source of claim 1 , further comprising a semiconductor substrate including electrical circuits fabricated thereon, the electrical circuits electrically coupled to the array of p-contacts and the plurality of n-contacts.

19. A method comprising:

fabricating a micro-light emitting diode (micro-LED) array that comprises:

an epitaxial layer stack including an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer, the epitaxial layer stack including a two-dimensional (2-D) array of mesa structures formed therein;

an array of p-contacts electrically coupled to the p-type semiconductor layer of the 2-D array of mesa structures;

a metal layer surrounding each individual mesa structure of the 2-D array of mesa structures; and

a plurality of n-contacts coupling the metal layer to the n-type semiconductor layer at a plurality of locations between the individual mesa structures of the 2-D array of mesa structures;

fabricating electrical circuits on a semiconductor substrate; and

bonding the micro-LED array to the semiconductor substrate such that the electrical circuits are coupled to the array of p-contacts and the plurality of n-contacts.

20. The method of claim 19 , further comprising forming a second metal layer on the n-type semiconductor layer, the metal layer and the second metal layer on opposite sides of the n-type semiconductor layer.

21. The method of claim 19 , wherein fabricating the micro-LED array comprises:

growing the epitaxial layer stack on a second substrate;

etching the epitaxial layer stack to form the 2-D array of mesa structures in the epitaxial layer stack;

depositing a first dielectric layer on surfaces of the 2-D array of mesa structures;

forming the plurality of n-contacts at regions between mesa structures of the 2-D array of mesa structures;

depositing the metal layer on the first dielectric layer and the plurality of n-contacts;

patterning the metal layer;

forming a patterned second dielectric layer on the metal layer;

forming the array of p-contacts in the patterned second dielectric layer;

forming a patterned third dielectric layer; and

forming p-electrodes and n-electrodes in the patterned third dielectric layer, the p-electrodes electrically connected to the array of p-contacts, and the n-electrodes electrically connected to the plurality of n-contacts.