Method for III-V/silicon hybrid integration
A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.
1 . An optoelectronic device comprising:
a precursor photonic device comprising:
a substrate,
a bonding region, for receiving and bonding to a transfer die, and
a plurality of first alignment marks, for use in transfer printing, said first alignment marks being located in or adjacent to the bonding region and etched into the substrate; and
a transfer die comprising:
a photonic device, said photonic device having a bonding surface suitable for bonding to a precursor photonic device, and
a plurality of second alignment marks, for use in a transfer-print process, wherein each of the plurality of second alignment marks of the transfer die is selected from two or more different types of alignment mark, and
wherein the photonic device is an electro-absorption modulator, wherein said electro-absorption modulator comprises an input waveguide and an output waveguide, and wherein both of said input waveguide and said output waveguide comprise a port located on a same side of the transfer die.
2 . The optoelectronic device of claim 1 , wherein the bonding region is in a cavity in the substrate.
3 . The optoelectronic device of claim 1 , further comprising an input waveguide, wherein the first alignment marks are configured to align a photonic device, located on the transfer die, relative to the input waveguide.
4 . The optoelectronic device of claim 1 , wherein the first alignment marks are provided as one or more etched regions and/or as one or more patterned metal surfaces.
5 . The optoelectronic device of claim 4 , wherein the first alignment marks are provided as one or more etched regions and the etched regions have a depth of at least 100 nm and no more than 3000 nm.
6 . The optoelectronic device of claim 1 , wherein the first alignment marks include one or more coarse alignment marks, and one or more fine alignment marks.
7 . The optoelectronic device of claim 6 , wherein the one or more coarse alignment marks project in at least two non-parallel directions.
8 . The optoelectronic device of claim 6 , wherein the one or more coarse alignment marks are shaped as any one or more of: an arrow, a cross, a T shape, and an L shape.
9 . The optoelectronic device of claim 6 , wherein the first alignment marks include two or more fine alignment marks which respectively project in at least two non-parallel directions.
10 . The optoelectronic device of claim 6 , wherein the one or more fine alignment marks include Vernier patterns.
11 . The optoelectronic device of claim 1 , wherein the precursor photonic device is a silicon-on-insulator wafer, including either or both of an input waveguide and an output waveguide, each adjacent to the bonding region.
12 . The optoelectronic device of claim 1 , wherein the photonic device is a III-V semiconductor device and/or the transfer die includes a sacrificial layer.
13 . The optoelectronic device of claim 1 , wherein the photonic device is formed at least partially from indium phosphide, and/or a sacrificial layer is formed of indium gallium arsenide.
14 . The optoelectronic device of claim 1 , wherein the second alignment marks of the transfer die are provided on an optically transparent region of the transfer die.
15 . The optoelectronic device of claim 1 , formed on an indium phosphide substrate.
16 . The optoelectronic device of claim 1 ,
wherein the first alignment marks allow for alignment in at least two non-parallel directions, the two non-parallel directions being parallel to the bonding region.
17 . An optoelectronic device comprising:
a precursor photonic device comprising:
a substrate;
a bonding region, for receiving and bonding to a transfer die; and
a plurality of alignment marks, for use in transfer printing, said alignment marks being located in or adjacent to the bonding region and etched into the substrate,
wherein the optoelectronic device further comprises a transfer die comprising a photonic device, said photonic device having a bonding surface suitable for bonding to a precursor photonic device,
wherein the transfer die includes a plurality of alignment marks, for use in a transfer-print process, wherein each of the plurality of alignment marks of the transfer die is selected from two or more different types of alignment marks, and
wherein the alignment marks of the transfer die are voids in the transfer die which extend entirely through the transfer die.