IP Library Granted Patent US 12661836
Granted Patent B2
US 12661836 · App. 18/930,412 · Granted Jun 23, 2026

Maintenance method for discharge unit

Inventors: Tatsuya Teramoto (Shiojiri, JP); Taki Hashimoto (Shiojiri, JP)
Assignee: Seiko Epson Corporation
B29C45/1753B29C45/47B29C45/74B29C2945/76006B29C2945/7618B29C2945/76545
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Quick Facts
Patent No.
US 12661836
App. No.
18/930,412
Granted
Jun 23, 2026
Kind
B2
Abstract

Provided is a maintenance method for a discharge unit which has a nozzle hole and plasticizes a material containing a thermoplastic resin to generate a plasticized material. This maintenance method includes a heating step of heating a material or a plasticized material present in a flow path which communicates with a nozzle hole and through which the material or the plasticized material passes at a temperature equal to or higher than the thermal decomposition temperature of the material or the plasticized material, and a releasing step of releasing the material or the plasticized material thermally decomposed in the heating step from the flow path.

Claims (25)

1 . A maintenance method for a discharge unit, the discharge unit including a nozzle hole and being configured to generate a plasticized material by plasticizing a material containing a thermoplastic resin, the method comprising:

heating the material or the plasticized material present in a flow path communicating with the nozzle hole and through which the material or the plasticized material passes, at a temperature not less than a thermal decomposition temperature of the material or the plasticized material, the discharge unit includes a discharge adjustment unit disposed in the flow path and configured to adjust the opening area of the flow path; and

releasing, from the flow path, the material or the plasticized material thermally decomposed in the heating by

closing the flow path using the discharge adjustment unit until a pressure in the flow path reaches a first specified value from a value lower than the first specified value; and

opening the flow path using the discharge adjustment unit when the pressure exceeds the first specified value.

2 . The maintenance method according to claim 1 , wherein

the heating is performed in a state where at least a part of a portion of the discharge unit excluding the flow path is cooled.

3 . The maintenance method according to claim 1 , wherein

the discharge unit includes a plasticizing unit configured to plasticize the material,

the plasticizing unit includes a screw rotated by a drive motor and including a groove forming surface formed with a groove, and heater, and

the heater heats the material or the plasticized material in the heating, and

the screw is rotated in the releasing.

4 . The maintenance method according to claim 1 , comprising maintaining the temperature in a state where the flow path is opened, after the flow path is opened.

5 . The maintenance method according to claim 1 , comprising

notifying that the thermal decomposition is completed when the pressure in the flow path decreases from a value exceeding a second specified value to a value not greater than the second specified value.

6 . The maintenance method according to claim 1 , comprising:

acquiring material information about the material from a storage unit; and

determining based on the material information whether or not thermal decomposition of the material is possible.

7 . The maintenance method according to claim 6 , comprising

activating an operation unit for executing the heating when it is determined that thermal decomposition of the material is possible.

8 . The maintenance method according to claim 1 , wherein

the discharge unit is detachably attached to a three-dimensional shaping apparatus, and

the heating and the releasing are performed in a state where the discharge unit is detached from the three-dimensional shaping apparatus and installed in a chamber.

9 . The maintenance method according to claim 8 , wherein

the heating is performed in a state where at least a part of a portion of the discharge unit installed in the chamber, excluding the flow path, is cooled.