Liquid ejecting head and liquid ejecting apparatus

1 . A liquid ejecting head comprising:

a nozzle substrate including a first nozzle;

a vibration plate;

a pressure chamber substrate including

a first pressure chamber in which pressure for ejecting liquid through the first nozzle is applied to liquid by the vibration plate, and

a first absorption chamber in which vibration of liquid propagated from the first pressure chamber is absorbed by the vibration plate; and

a sealing substrate including

a first-pressure-chamber recess associated with the first pressure chamber, and

a first-absorption-chamber recess associated with the first absorption chamber,

wherein when a first direction is defined as a direction in which the first pressure chamber and the first absorption chamber are aligned, a width of the first-absorption-chamber recess in the first direction is smaller than a width of the first absorption chamber in the first direction.

2 . The liquid ejecting head according to claim 1 , wherein

when a first side is defined as a first-pressure-chamber side in the first direction with respect to the first absorption chamber, and a stacking direction is defined as a direction in which the pressure chamber substrate and the sealing substrate are stacked,

the sealing substrate includes a first holding portion not overlapping the pressure chamber substrate and overlapping the vibration plate in the stacking direction,

in a portion that is part of a periphery of the first-absorption-chamber recess in the sealing substrate and is located between an end portion of the first-absorption-chamber recess on the first side and an end portion of the first absorption chamber on the first side.

3 . The liquid ejecting head according to claim 1 , wherein

when a second side is defined as a side opposite to a first-pressure-chamber side in the first direction with respect to the first absorption chamber, and a stacking direction is defined as a direction in which the pressure chamber substrate and the sealing substrate are stacked,

the sealing substrate includes a second holding portion not overlapping the pressure chamber substrate and overlapping the vibration plate in the stacking direction,

in a portion that is part of a periphery of the first-absorption-chamber recess in the sealing substrate and is located between an end portion of the first-absorption-chamber recess on the second side and an end portion of the first absorption chamber on the second side.

4 . The liquid ejecting head according to claim 1 , wherein

when a first side is defined as a first-pressure-chamber side in the first direction with respect to the first absorption chamber, a second side is defined as a side opposite to the first side, and a stacking direction is defined as a direction in which the pressure chamber substrate and the sealing substrate are stacked,

the sealing substrate includes a first holding portion not overlapping the pressure chamber substrate and overlapping the vibration plate in the stacking direction, in a portion that is part of periphery of the first-absorption-chamber recess in the sealing substrate and is located between an end portion of the first-absorption-chamber recess on the first side and an end portion of the first absorption chamber on the first side,

the sealing substrate includes a second holding portion not overlapping the pressure chamber substrate and overlapping the vibration plate in the stacking direction, in a portion that is part of periphery of the first-absorption-chamber recess in the sealing substrate and is located between an end portion of the first-absorption-chamber recess on the second side and an end portion of the first absorption chamber on the second side, and

a width of the first holding portion in the first direction is larger than width of the second holding portion in the first direction.

5 . The liquid ejecting head according to claim 1 , wherein

when a second direction is defined as a direction intersecting the first direction,

the nozzle substrate further includes a second nozzle at a position different from the position of the first nozzle in the second direction,

the pressure chamber substrate further includes a second pressure chamber in which pressure for ejecting liquid through the second nozzle is applied to liquid by the vibration plate, and

the first absorption chamber communicates with both the first pressure chamber and the second pressure chamber.

6 . The liquid ejecting head according to claim 5 , wherein a width of the first-pressure-chamber recess in the first direction is larger than a width of the first pressure chamber in the first direction.

7 . The liquid ejecting head according to claim 1 , wherein the first pressure chamber is adjacent to the first absorption chamber in the first direction.

8 . The liquid ejecting head according to claim 1 , wherein

the pressure chamber substrate further includes a second absorption chamber in which vibration of liquid propagated from the first pressure chamber is absorbed by the vibration plate,

the sealing substrate further includes a second-absorption-chamber recess associated with the second absorption chamber,

the first pressure chamber is located between the first absorption chamber and the second absorption chamber in the first direction,

a separation distance between the first pressure chamber and the first absorption chamber in the first direction is shorter than a separation distance between the first pressure chamber and the second absorption chamber in the first direction, and

liquid flows through the first absorption chamber, the first pressure chamber, and the second absorption chamber in this order.

9 . The liquid ejecting head according to claim 8 , wherein a width of the second-absorption-chamber recess in the first direction is smaller than a width of the second absorption chamber in the first direction.

10 . The liquid ejecting head according to claim 9 , wherein

when a first side is defined as a first-pressure-chamber side in the first direction with respect to the first absorption chamber, and a stacking direction is defined as a direction in which the pressure chamber substrate and the sealing substrate are stacked,

the sealing substrate includes a third holding portion not overlapping the pressure chamber substrate and overlapping the vibration plate in the stacking direction,

in a portion that is part of a periphery of the second-absorption-chamber recess in the sealing substrate and is located between an end portion of the second-absorption-chamber recess on the first side and an end portion of the second absorption chamber on the first side.

11 . The liquid ejecting head according to claim 9 , wherein

when a second side is defined as a side opposite to a first-pressure-chamber side in the first direction with respect to the first absorption chamber, and a stacking direction is defined as a direction in which the pressure chamber substrate and the sealing substrate are stacked,

the sealing substrate includes a fourth holding portion not overlapping the pressure chamber substrate and overlapping the vibration plate in the stacking direction,

in a portion that is part of a periphery of the second-absorption-chamber recess in the sealing substrate and is located between an end portion of the second-absorption-chamber recess on the second side and an end portion of the second absorption chamber on the second side.

12 . The liquid ejecting head according to claim 9 , wherein a difference in a width in the first direction between the second-absorption-chamber recess and the second absorption chamber is smaller than a difference in a width in the first direction between the first-absorption-chamber recess and the first absorption chamber.

13 . The liquid ejecting head according to claim 1 , further comprising:

a piezoelectric material configured to be driven by a voltage applied to the piezoelectric material;

an upper electrode located over the piezoelectric material and electrically coupled to the piezoelectric material;

a lower electrode located under the piezoelectric material and electrically coupled to the piezoelectric material; and

upper-electrode wiring located over the upper electrode and configured to electrically couple the upper electrode to an external power supply, wherein

the vibration plate, an interposed member formed of the same material as the lower electrode and not electrically coupled to the lower electrode, the piezoelectric material, the upper electrode, and the upper-electrode wiring are located in this order over the first absorption chamber.

14 . The liquid ejecting head according to claim 1 , further comprising:

a piezoelectric material configured to be driven by a voltage applied to the piezoelectric material;

an upper electrode located over the piezoelectric material and electrically coupled to the piezoelectric material;

a lower electrode located under the piezoelectric material and electrically coupled to the piezoelectric material; and

upper-electrode wiring located over the upper electrode and configured to electrically couple the upper electrode to an external power supply, wherein

the vibration plate and the upper-electrode wiring are located in this order over the first absorption chamber, and the piezoelectric material, the lower electrode, and the upper electrode are not present over the first absorption chamber.

15 . The liquid ejecting head according to claim 1 , further comprising:

a piezoelectric material configured to be driven by a voltage applied to the piezoelectric material;

an upper electrode located over the piezoelectric material and electrically coupled to the piezoelectric material;

a lower electrode located under the piezoelectric material and electrically coupled to the piezoelectric material; and

upper-electrode wiring located over the upper electrode and configured to electrically couple the upper electrode to an external power supply, wherein

the vibration plate, an interposed member formed of the same material as the lower electrode and not electrically coupled to the lower electrode, the piezoelectric material, the upper electrode, and the upper-electrode wiring are located in this order over both end portions of the first absorption chamber in the first direction.

16 . A liquid ejecting apparatus comprising:

the liquid ejecting head according to claim 1 ; and

a controller configured to control ejection operation of ejecting liquid from the liquid ejecting head.