Laminated substrate, liquid ejection head, and method of manufacturing laminated substrate
An object is to provide a laminated substrate, a liquid ejection head, and a method of manufacturing a laminated substrate which are capable of preventing a decrease in the yield of a manufacturing process due to the substrate getting broken and an organic resin material sticking out. To that end, a structure including an eave portion having an overhang with a predetermined length is provided on a predetermined surface of a first substrate so as to form a space between the structure and the predetermined surface, and a resin is filled in the space.
1 . A laminated substrate comprising:
a first substrate having a predetermined surface;
a structure including an eave portion having an overhang with a predetermined length provided on the predetermined surface so as to form a space between the structure and the predetermined surface;
a resin provided on a side of the structure opposite to the first substrate; and
a second substrate bonded to the first substrate by the resin via the structure,
wherein the resin is filled in at least part of the space.
2 . The laminated substrate according to claim 1 , wherein the resin is an organic resin material.
3 . The laminated substrate according to claim 1 , wherein part of the eave portion of the structure is out of a region between the first substrate and the second substrate.
4 . The laminated substrate according to claim 1 , wherein the eave portion of the structure has such a pectinate shape that comb teeth are formed on a tip side.
5 . The laminated substrate according to claim 1 , wherein the structure is provided in a plurality on the predetermined surface of the first substrate.
6 . A laminated substrate comprising:
a first substrate having a predetermined surface;
a structure provided on the predetermined surface;
a resin provided on a side of the structure opposite to the first substrate; and
a second substrate bonded to the first substrate by the resin via the structure,
wherein the structure includes a holding portion to hold the resin with a capillary force,
wherein the resin is filled in at least part of the holding portion.
7 . A liquid ejection head comprising:
a first substrate on which part of a channel is formed, the first substrate having a predetermined surface;
a structure including an eave portion having an overhang with a predetermined length provided on the predetermined surface so as to form a space between the structure and the predetermined surface;
a resin provided on a side of the structure opposite to the first substrate; and
a second substrate bonded to the first substrate by the resin via the structure, wherein the resin is filled in at least part of the space.
8 . A method of manufacturing a laminated substrate comprising:
preparing a first substrate having a predetermined surface;
providing a structure including an eave portion having an overhang with a predetermined length on the predetermined surface so as to form a space between the structure and the predetermined surface;
providing a resin on a side of the structure opposite to the first substrate; and
bonding the first substrate and a second substrate by the resin via the structure,
wherein the step of providing the resin comprises filling the resin in at least part of the space.
9 . The method according to claim 8 , further comprising:
forming a film of a second material on a front surface of the first substrate; and
patterning the film of the second material,
wherein the providing of the structure includes:
forming a film of a first material to be the structure on the front surface of the first substrate and a front surface of the film of the second material;
patterning the film of the first material;
etching the film of the first material; and
removing the film of the second material.
10 . The method according to claim 9 , wherein the first material is any one of SiC, SiOC, SiCN, SiOCN, TiO, TaO, HfO, or ZrO.
11 . The method according to claim 9 , wherein the second material is any one of TiW, W, Cr, Al, or SiO.