IP Library Granted Patent US 12661925
Granted Patent B2
US 12661925 · App. 18/707,042 · Granted Jun 23, 2026

Digital embossing of decorative surface coverings

Inventors: Diego Gourdin (Wiltz, LU); Richard Peres (Wiltz, LU); Jean-Yves Simon (Wiltz, LU)
Assignee: TARKETT GDL
B44C5/04B41J3/38B41M3/06B44C3/025
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Quick Facts
Patent No.
US 12661925
App. No.
18/707,042
Granted
Jun 23, 2026
Kind
B2
Abstract

Aspects of the present invention relate to a resilient multilayer decorative surface covering and a method for producing a resilient multilayer decorative surface covering. The method comprises providing a substrate ( 36 ) and digitally embossing a coating on the substrate. Digitally embossing the coating comprises applying a plurality of plastisol or organosol layers ( 40 a, 40 b ) so as to produce a coating having a three-dimensional surface relief, wherein at least one of the plurality of plastisol or organosol layers is structurally patterned.

Claims (29)

1 . A method for producing a resilient multilayer decorative surface covering, the method, comprising:

providing a substrate; and

digitally embossing a coating on the substrate, wherein digitally embossing the coating comprises applying a plurality of plastisol or organosol layers so as to confer to the coating a three-dimensional surface relief, wherein at least one of the plurality of plastisol or organosol layers is structurally patterned;

wherein applying the plurality of plastisol or organosol layers comprises:

depositing plastisol or organosol on the substrate, the plastisol or organosol comprising a first plasticizer having a first solution temperature at the clear point, measured according to DIN 53408:1967-06 (5% S-PVC; K-value 71), the plastisol or organosol having an initial gelation temperature;

applying, in a pattern, a second plasticizer on the deposited plastisol or organosol, the second plasticizer having a second solution temperature at the clear point, measured according to DIN 53408:1967-06 (5% S-PVC; K-value 71), the second solution temperature at the clear point being different from the first solution temperature at the clear point, so as to impart to the deposited plastisol or organosol a spatially modulated gelation temperature between a lowest gelation temperature and a highest gelation temperature;

heating the plastisol or organosol to a heating temperature comprised between the lowest gelation temperature and the highest gelation temperature of the plastisol or organosol so as to selectively gel the plastisol or organosol in areas where the gelation temperature is lower than the heating temperature; and

removing the plastisol or organosol so as to keep the selectively gelled plastisol or organosol areas on the substrate, thereby producing a structurally patterned plastisol or organosol layer.

2 . The method according to claim 1 , wherein depositing plastisol or organosol comprises depositing one or more plastisol or organosol blobs on the substrate.

3 . The method according to claim 1 , wherein applying the plurality of plastisol or organosol layers comprises gelling one or more plastisol or organosol layers that are already applied on the substrate.

4 . The method according to claim 1 , further comprising fusing the digitally embossed coating.

5 . The method according to claim 1 , wherein the substrate comprises a décor layer, digitally embossing of the coating on the substrate being effected in register with the décor layer.

6 . The method according to claim 1 , wherein depositing plastisol or organosol is effected so as to produce a thickness-modulated plastisol or organosol layer.

7 . The method according to claim 5 , wherein the substrate comprises a wear layer on top of the décor layer.

8 . The method according to claim 1 , wherein the resilient multilayer decorative surface covering is provided as a slab.

9 . The method according to claim 1 , wherein the plastisol or organosol layers are PVC plastisol layers, and the plastisol or organosol is a PVC plastisol.

10 . The method according to claim 1 , comprising:

providing a three-dimensional model file to a digital embosser, the model file comprising instructions to the digital embosser for embossing the coating having the three-dimensional surface relief, the model file defining raised and depressed surface regions for the coating to be digitally embossed;

wherein the digitally embossing is performed by the digital embosser based on the three-dimensional model file.

11 . The method according to claim 10 , wherein the model file comprises instructions including a desired embossing pattern for at least one of the one or more plurality of plastisol or organosol layers.

12 . A method for producing a resilient multilayer decorative surface covering, the method comprising:

providing a substrate; and

digitally embossing a coating on the substrate, wherein digitally embossing the coating comprises applying a plurality of plastisol or organosol layers so as to confer to the coating a three-dimensional surface relief, wherein at least one of the plurality of plastisol or organosol layers is structurally patterned;

wherein applying the plurality of plastisol or organosol layers comprises depositing, in a pattern, plastisol or organosol on the substrate so as to produce a plastisol or organosol layer that is structurally patterned, the depositing comprising:

depositing plastisol or organosol on the substrate, the plastisol or organosol comprising a first plasticizer having a first solution temperature at the clear point, measured according to DIN 53408:1967-06 (5% S-PVC; K-value 71), the plastisol or organosol having an initial gelation temperature; and

applying, in a pattern, a second plasticizer on the deposited plastisol or organosol, the second plasticizer having a second solution temperature at the clear point, measured according to DIN 53408:1967-06 (5% S-PVC; K-value 71), the second solution temperature at the clear point being different from the first solution temperature at the clear point, so as to impart to the deposited plastisol or organosol a spatially modulated gelation temperature between a lowest gelation temperature and a highest gelation temperature;

heating the plastisol or organosol to a heating temperature comprised between the lowest gelation temperature and the highest gelation temperature of the plastisol or organosol so as to selectively gel the plastisol or organosol in areas where the gelation temperature is lower than the heating temperature; and

removing the plastisol or organosol so as to keep the selectively gelled plastisol or organosol areas on the substrate, thereby producing a structurally patterned plastisol or organosol layer.

13 . The method according to claim 3 , wherein the gelling of the one or more plastisol or organosol layers that are already applied on the substrate, is carried out before applying a further plastisol or organosol layer.