Decoupling method for semiconductor device

1 . A sensor package, comprising:

a packaging comprising a package bottom, first and second sidewalls extending upwardly from first and second opposite sides of the package bottom, and third and fourth sidewalls extending upwardly from third and fourth opposite sides of the package bottom, wherein the first, second, third, and fourth sidewalls and the package bottom define a cavity;

an integrated circuit attached to the package bottom;

a plate extending between at least two from among the first, second, third, and fourth sidewalls within the cavity and being spaced apart from the package bottom;

at least one sensor attached to a top surface of the plate;

wire bondings electrically connecting pads on a top face of the at least one sensor to corresponding pads on a top face of the integrated circuit; and

a lid extending across and between the first, second, third, and fourth sidewalls to thereby close the cavity.

2 . The sensor package of claim 1 , wherein the plate extends between the first and second sidewalls and has an opening formed therein; and wherein the wire bondings pass through the opening to electrically connect the pads on the top face of the at least one sensor to the corresponding pads on the top face of the integrated circuit.

3 . The sensor package of claim 2 :

wherein the first sidewall comprises a first portion extending upwardly from the first side of the package bottom and a second portion extending upwardly from a distal end of the first portion, with the second portion being thinner than the first portion in a stair-stepped shape so as to define a first support shelf;

wherein the second sidewall comprises a first portion extending upwardly from the second side of the package bottom and a second portion extending upwardly from a distal end of the second portion, with the second portion of the second sidewall being thinner than the first portion of the second sidewall in a stair-stepped shape so as to define a second support shelf, and

wherein the plate is carried by and extends between the first and second support shelves.

4 . The sensor package of claim 1 :

wherein the plate extends between the first and second sidewalls and has an opening formed therein;

wherein the at least one sensor comprises first and second sensors attached to the top surface of the plate on opposite sides of the opening; and

wherein the wire bondings comprise: first wire bondings passing through the opening to electrically connect the pads on the top face of the first sensor to the corresponding pads on the top face of the integrated circuit; and second wire bondings passing through the opening to electrically connect the pads on the top face of the second sensor to the corresponding pads on the top face of the integrated circuit.

5 . The sensor package of claim 1 , wherein the packaging and plate are constructed from ceramic.

6 . The sensor package of claim 1 , wherein the lid is constructed from metal.

7 . The sensor package of claim 1 , wherein the integrated circuit is an application specific integrated circuit (ASIC).

8 . The sensor package of claim 1 , further comprising:

vias formed within the package bottom to electrically connect pads on a top surface of the package bottom to corresponding pads on a bottom surface of the package bottom; and

additional wire bondings electrically connecting the pads on the top surface of the package bottom to corresponding pads on the top face of the integrated circuit.

9 . The sensor package of claim 1 , wherein the plate extends between the third and fourth sidewalls, adjacent to the first sidewall; and wherein the wire bondings extend past a side end of the plate to electrically connect the pads on the top face of the at least one sensor to the corresponding pads on the top face of the integrated circuit.

10 . The sensor package of claim 9 , wherein the plate is sized to extend outwardly from the first sidewall toward the second sidewall but not reach the second sidewalls.

11 . The sensor package of claim 9 :

wherein the first sidewall comprises a first portion extending upwardly from the first side of the package bottom and a second portion extending upwardly from a distal end of the first portion, with the second portion being thinner than the first portion in a stair-stepped shape so as to define a first support shelf; and

wherein the plate is carried by the first support shelf.

12 . The sensor package of claim 11 , wherein the second sidewall has a substantially constant thickness.

13 . The sensor package of claim 1 :

wherein the plate extends between the third and fourth sidewalls, adjacent to the first sidewall, with the plate being sized to extend outwardly from the first sidewall toward the second sidewall but not reach the second sidewall;

wherein the at least one sensor comprises first and second sensors attached to the top surface of the plate; and

wherein the wire bondings comprise: first wire bondings extending past a side end of the plate to electrically connect the pads on the top face of the first sensor to the corresponding pads on the top face of the integrated circuit; and second wire bondings extending past the side end of the plate to electrically connect the pads on the top face of the second sensor to the corresponding pads on the top face of the integrated circuit.

14 . A semiconductor device package, comprising:

a packaging having a package bottom and sidewalls extending upwardly from the package bottom to define a cavity;

an integrated circuit attached to the package bottom within the cavity;

at least one sensor attached within the cavity; and

a plate extending between at least two of the sidewalls within the cavity and spaced apart from the package bottom, the plate having an opening formed therein; and

wire bondings passing through the opening to electrically connect pads on a top face of the at least one sensor to corresponding pads on a top face of the integrated circuit.

15 . The semiconductor device package of claim 14 , wherein the at least one sensor comprises first and second sensors attached to a top surface of the plate.

16 . The semiconductor device package of claim 15 , wherein the first and second sensors are positioned on opposite sides of an opening formed in the plate.

17 . The semiconductor device package of claim 14 , wherein the at least one sensor comprises a microelectromechanical systems (MEMS) device.

18 . The semiconductor device package of claim 14 , wherein the packaging and plate are constructed from ceramic.

19 . The semiconductor device package of claim 14 , wherein the integrated circuit comprises an application specific integrated circuit (ASIC).