Maleimide resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor package
The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof, and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) dissolves in an alcohol-based solvent, a ketone-based solvent, an aromatic hydrocarbon-based solvent, an ester-based solvent, or a nitrogen atom-containing solvent in an amount of 30% by mass or more at 25° C. The present invention also relates to a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.
1 . A maleimide resin composition comprising
(A) one or more selected from a group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof, and
(B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein
the component (A) dissolves in an alcohol-based solvent, a ketone-based solvent, an aromatic hydrocarbon-based solvent, an ester-based solvent, or a nitrogen atom-containing solvent in an amount of 30% by mass or more at 25° C., and
the component (B) comprises (B1) a modified conjugated diene polymer obtained by modifying (b1) a conjugated diene polymer having a vinyl group in a side chain thereof with (b2) a maleimide compound having two or more N-substituted maleimide groups.
2 . The maleimide resin composition according to claim 1 , wherein the component (A) is a maleimide compound containing an alicyclic hydrocarbon group.
3 . The maleimide resin composition according to claim 2 , wherein the alicyclic hydrocarbon group is contained as part of an indane ring.
4 . The maleimide resin composition according to claim 1 , wherein the component (B) is a polymer having a hydrocarbon chain in a main chain thereof.
5 . The maleimide resin composition according to claim 1 , wherein the component (B1) has, on a side chain thereof, a substituent obtained by reacting the vinyl group of the component (b1) with the N-substituted maleimide group of the component (b2).
6 . The maleimide resin composition according to claim 1 , wherein the component (b1) is polybutadiene having a 1,2-vinyl group.
7 . The maleimide resin composition according to claim 1 , wherein a content ratio of the component (A) and the component (B) [(A)/(B)] is 0.3 to 3.0 on a mass basis.
8 . A prepreg comprising the maleimide resin composition according to claim 1 or a semi-cured product of the maleimide resin composition.
9 . A laminate comprising a cured product of the maleimide resin composition according to claim 1 .
10 . A resin film comprising the maleimide resin composition according to claim 1 or a semi-cured product of the maleimide resin composition.
11 . A printed wiring board comprising a cured product of the maleimide resin composition according to claim 1 .
12 . A semiconductor package comprising the printed wiring board according to claim 11 and a semiconductor element.
13 . The maleimide resin composition according to claim 1 , wherein the component (A) dissolves in toluene in an amount of 30% by mass or more at 25° C.
14 . The maleimide resin composition according to claim 1 , wherein the component (B) further comprises (B2) a styrene-based elastomer.
15 . The maleimide resin composition according to claim 14 , wherein the content ratio of the component (B1) and the component (B2) [(B1)/(B2)] is 5/95 to 70/30 on a mass basis.
16 . The maleimide resin composition according to claim 1 , wherein the content of the component (A) is 35 to 60 parts by mass and the content of the component (B) is 40 to 65 parts by mass, based on 100 parts by mass of the total resin components in the resin composition.
17 . The maleimide resin composition according to claim 1 ,
wherein the component (A) dissolves in toluene in an amount of 30% by mass or more at 25° C.,
wherein the component (B) further comprises (B2) a styrene-based elastomer, wherein the content ratio of the component (B1) and the component (B2) [(B1)/(B2)] is 5/95 to 70/30 on a mass basis, and
wherein the content of the component (A) is 35 to 60 parts by mass and the content of the component (B) is 40 to 65 parts by mass, based on 100 parts by mass of the total resin components in the resin composition.
18 . The maleimide resin composition according to claim 1 ,
wherein the component (A) dissolves in toluene in an amount of 30% by mass or more at 25° C.,
wherein the component (B) further comprises (B2) a styrene-based elastomer,
wherein the content ratio of the component (B1) and the component (B2) [(B1)/(B2)] is 5/95 to 70/30 on a mass basis,
wherein the content of the component (A) is 35 to 60 parts by mass and the content of the component (B) is 40 to 65 parts by mass, based on 100 parts by mass of the total resin components in the resin composition, and
wherein the component (A) comprises at least one selected from the group consisting of a maleimide compound containing an alicyclic hydrocarbon group and a maleimide compound having a biphenylaralkyl skeleton.
19 . The maleimide resin composition according to claim 1 ,
wherein the component (A) dissolves in toluene in an amount of 30% by mass or more at 25° C.,
wherein the component (B) further comprises (B2) a styrene-based elastomer,
wherein the content ratio of the component (B1) and the component (B2) [(B1)/(B2)] is 5/95 to 70/30 on a mass basis,
wherein the content of the component (A) is 35 to 60 parts by mass and the content of the component (B) is 40 to 65 parts by mass, based on 100 parts by mass of the total resin components in the resin composition, and
wherein the component (A) is a maleimide compound containing an alicyclic hydrocarbon group and the alicyclic hydrocarbon group is contained as part of an indane ring.