IP Library › Granted Patent US 12662738
Granted Patent B2
US 12662738 · App. 18/832,527 · Granted Jun 23, 2026

Composition for depositing a palladium coating on a substrate

Inventors: Donny Lautan (Berlin, DE); Dimitri Voloshyn (Berlin, DE); Isabel-Roda Hirsekorn (Berlin, DE); Dirk Tews (Berlin, DE)
Assignee: Atotech Deutschland GmbH & Co. KG
C23C18/42B32B15/01C23C18/1637B32B2311/09B32B2311/12
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Quick Facts
Patent No.
US 12662738
App. No.
18/832,527
Granted
Jun 23, 2026
Kind
B2
Abstract

The present invention is directed to a composition for depositing a palladium coating on an activated copper-coated substrate, the composition comprising: (i) palladium ions, (ii) chloride ions, (iii) ethylenediamine (EDA), (iv) ethylenediamine disuccinate (EDDS), and (v) at least one reducing agent, wherein the composition has a pH in a range from 7.5 to 9.5, preferably from 7.6 to 9.1, more preferably from 7.7 to 8.7, and most preferably from 7.8 to 8.5.

Claims (17)

1 . A composition for depositing a palladium coating on an activated copper-coated substrate, the composition comprising:

(i) palladium ions,

(ii) chloride ions,

(iii) ethylenediamine (EDA),

(iv) ethylenediamine disuccinate (EDDS), and

(v) at least one reducing agent,

wherein the composition has a pH in a range from 7.5 to 9.5,

wherein the composition comprises the palladium ions in a total concentration in a range from 0.3 g/L to 2.0 g/L, based on the total volume of the composition, and wherein in the composition the ratio of palladium ions to ethylenediamine (EDA) is from 1:3 to 1:5.

2 . The composition according to claim 1 , wherein the composition comprises the ethylenediamine (EDA) in a total concentration in a range from 10 mM to 75 mM.

3 . The composition according to claim 1 , wherein the composition comprises the chloride ions in a total concentration in a range from 25 mM to 200 mM.

4 . The composition according to claim 1 , wherein the composition comprises the ethylenediamine disuccinate (EDDS) in a total concentration in a range from 5 mM to 60 mM.

5 . The composition according to claim 1 , wherein the composition comprises the reducing agent in a total concentration in a range from 200 mM to 1000 mM.

6 . The composition according to claim 1 , wherein the composition does not comprise any boron hydride and/or phosphite compounds.

7 . The composition of claim 1 wherein the at least one reducing agent comprises formate ions.

8 . The composition of claim 1 wherein the composition comprises the reducing agent in a total concentration in a range from 450 mM to 550 mM.

9 . A process for depositing a pure palladium coating on an activated copper-coated substrate, comprising applying the composition of claim 1 to said activated copper-coated substrate.

10 . The process according to claim 9 , wherein the composition provides a metal turn over (MTO) up to 20, wherein the metal turn over (MTO) corresponds to the number of times palladium ions can be added to the composition during deposition before the composition has to be replaced.