IP Library Granted Patent US 12662739
Granted Patent B2
US 12662739 · App. 18/396,617 · Granted Jun 23, 2026

Surface-modified aluminum alloy substrate structure

Inventors: Yi-Hsin Huang (New Taipei City, TW); Ching-Ming Yang (New Taipei City, TW); Kuo-Wei Lee (New Taipei City, TW); Tze-Yang Yeh (New Taipei City, TW)
Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
C23C28/021B32B15/016B32B15/017B32B15/04B32B15/043B32B15/20C23C14/16C23C14/165C23C28/023C23C30/00C23C30/005C22C21/02C22C21/08Y10T428/12736Y10T428/12764Y10T428/12792Y10T428/12903Y10T428/12944Y10T428/24942Y10T428/2495Y10T428/26Y10T428/265
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Quick Facts
Patent No.
US 12662739
App. No.
18/396,617
Granted
Jun 23, 2026
Kind
B2
Abstract

A surface-modified aluminum alloy substrate structure includes a 6000-Series aluminum alloy substrate, a diffusion buffer layer, and a meltable metallic layer. The diffusion buffer layer is formed on the 6000-Series aluminum alloy substrate for buffering magnesium in the 6000-Series aluminum alloy substrate from diffusing to a meltable metallic layer. The meltable metallic layer is formed on the diffusion buffer layer for being melted in a subsequent process.

Claims (11)

1 . A surface-modified aluminum alloy substrate structure, comprising:

a 6000-Series aluminum alloy substrate;

a diffusion buffer layer formed on the 6000-Series aluminum alloy substrate for buffering magnesium in the 6000-Series aluminum alloy substrate from diffusing to a meltable metallic layer;

a meltable metallic layer formed on the diffusion buffer layer for being melted in a subsequent process; and

a brazing promotion layer formed on the meltable metallic layer for enhancing a eutectic reaction; wherein the brazing promotion layer is made of an alloy that includes copper, nickel, and zinc.

2 . The surface-modified aluminum alloy substrate structure according to claim 1 , wherein the diffusion buffer layer is made of one of a 3000-Series aluminum alloy and a 1000-Series aluminum alloy.

3 . The surface-modified aluminum alloy substrate structure according to claim 2 , wherein the diffusion buffer layer is a thin layer formed on the 6000-Series aluminum alloy substrate by rolling and has a thickness of 1 mm or less.

4 . The surface-modified aluminum alloy substrate structure according to claim 1 , wherein the meltable metallic layer is an aluminum-silicon alloy layer.

5 . The surface-modified aluminum alloy substrate structure according to claim 4 , wherein the meltable metallic layer is a thin layer formed on the diffusion buffer layer by rolling and has a thickness of 0.3 mm or less.

6 . The surface-modified aluminum alloy substrate structure according to claim 1 , wherein the brazing promotion layer is an extremely thin layer formed on the meltable metallic layer by rolling and has a thickness of 0.005 mm or less.

7 . The surface-modified aluminum alloy substrate structure according to claim 1 , wherein the brazing promotion layer is an extremely thin layer formed on the meltable metallic layer by physical vapor deposition and has a thickness of 0.005 mm or less.