Integrated cooling module
An integrated cooling module includes a plate-shaped manifold and multiple cooling components mounted thereon. The manifold includes stacked first and second plates that form a first refrigerant channel recessed along a line structure of the first plate, while the second plate provides a flat sealing surface. A third plate can be further stacked to form a second refrigerant channel, and through-holes in the second plate allow communication between channels. Ports formed in the plates enable direct connection with external components. A condenser, chiller, expansion valve, pressure/temperature sensor, and an accumulator may be mounted on the manifold, which is arranged perpendicular to a bottom surface.
1 . An integrated cooling module comprising:
a plate-shaped manifold; and
components mounted on a component-mounting surface of the plate-shaped manifold,
wherein the plate-shaped manifold has a structure in which a first plate and a second plate are stacked and coupled to each other to form a first refrigerant channel between the first plate and the second plate,
wherein the first refrigerant channel is recessed in a first linear structure formed on an inner surface of the first plate, and
wherein the second plate is a flat plate having a first flat surface facing the first plate, and a second flat surface facing the first flat surface.
2 . The integrated cooling module of claim 1 , wherein a border surface of the inner surface of the first plate that adjoins the first flat surface of the second plate is a flat surface.
3 . The integrated cooling module of claim 1 , wherein at least a part of the first flat surface of the second plate has a shape corresponding to the shape of the inner surface of the first plate.
4 . The integrated cooling module of claim 1 , wherein one or more first ports are formed in the first plate to communicate directly with the first refrigerant channel and with an external component.
5 . The integrated cooling module of claim 1 , wherein the plate-shaped manifold is installed such that a plate surface of the manifold extends in a vertical direction relative to an installation surface on a vehicle.
6 . The integrated cooling module of claim 5 , wherein the components mounted on the plate-shaped manifold include a condenser, a chiller, a pressure/temperature sensor, and an expansion valve.
7 . The integrated cooling module of claim 6 , wherein the condenser and the chiller are disposed such that mounted on the plate-shaped manifold extends substantially in the vertical direction of the installed manifold.
8 . The integrated cooling module of claim 6 , wherein an accumulator is further mounted on a side surface of the plate-shaped manifold, and the accumulator communicates with the first refrigerant channel.
9 . The integrated cooling module of claim 8 , wherein the condenser is disposed at one lateral end, of the component-mounting surface and the accumulator is disposed at an opposite lateral end of component-mounting surface of the plate-shaped manifold.
10 . The integrated cooling module of claim 8 , wherein the condenser is a water-cooled condenser, and a plate type inner heat exchanger is further mounted on the component-mounting surface of the plate-shaped manifold.
11 . The integrated cooling module of claim 8 , wherein the condenser is an air-cooled condenser, and an inner heat exchanger is integrally accommodated in the accumulator.
12 . The integrated cooling module of claim 1 , wherein the plate-shaped manifold further comprises a third plate,
wherein the the second plate and the third plate are stacked and coupled to each other to form a second refrigerant channel between the second plate and the third plate, and
wherein the second refrigerant channel is recessed in a second linear structure formed on an inner surface of the third plate formed along the second refrigerant channel.
13 . The integrated cooling module of claim 12 , wherein a border surface of the inner surface of the third plate is a flat surface and adjoins a flat surface of the second plate.
14 . The integrated cooling module of claim 12 , wherein at least a part of the flat surface of the second plate has a shape corresponding to the shape of the inner surface of the third plate.
15 . The integrated cooling module of claim 12 , wherein one or more second ports are formed in the third plate and communicate directly with the second refrigerant channel and with an external component.
16 . The integrated cooling module of claim 12 , wherein the second plate includes one or more through-holes extending through the second plate to allow the first refrigerant channel and the second refrigerant channel to communicate with each other.
17 . The integrated cooling module of claim 12 , wherein an accumulator is mounted on a side surface of the plate-shaped manifold, and the accumulator communicates with both the first refrigerant channel and the second refrigerant channel.