Heat dissipation device

1 . A heat dissipation device, comprising:

a first vapor chamber including a first upper cover, a first lower cover, two first openings and a capillary layer, wherein the first upper cover and the first lower cover are assembled with each other to surround and define a first chamber, the capillary layer is disposed on the first lower cover and located in the first chamber, the two first openings are spaced apart from each other and formed penetrating through the first upper cover and communicate with the first chamber, and the first lower cover is used to contact a heat source; and

a second vapor chamber disposed on the first vapor chamber and including:

a second upper cover;

a second lower cover assembled with the second upper cover to form a plate-like structure, wherein the plate-like structure is bent by stamping to define two bending portions and a middle portion after the second upper cover and the second lower cover are assembled with each other, wherein the middle portion is spaced apart from the first upper cover, wherein the two bending portions are bent to connect opposite ends of the middle portion, and are respectively inserted into the two first openings to be connected to the first upper cover;

a second chamber communicated with the first chamber and surrounded and defined by the second lower cover and the second upper cover;

a plurality of first support units disposed on the second upper cover, located in the second chamber and corresponding to the middle portion;

a plurality of second support units disposed on the second upper cover, located in the second chamber, and respectively located on opposite sides of the plurality of first support units, wherein the plurality of second support units are long strips corresponding to the two bending portions and a part of the middle portion;

a plurality of second openings respectively formed in the two bending portions and communicating with the second chamber, wherein the plurality of second openings are located in the first chamber when the two bending portions are respectively inserted into the two first openings; and

a plurality of first capillary structures accommodated in the second chamber and extended to the first chamber via the plurality of second openings and the two first openings respectively,

wherein the plurality of first capillary structures are bonded to the capillary layer,

wherein the first vapor chamber further comprises a bonding layer formed between the plurality of first capillary structures and the capillary layer, or formed on the capillary layer and covering the plurality of first capillary structures,

wherein the bonding layer is composed of powdered metal and polymer material, and a weight ratio of the powdered metal to the polymer material is less than or equal to 1.

2 . The heat dissipation device of claim 1 , wherein the second vapor chamber further comprises a second capillary structure disposed on the second lower cover and located in the second chamber.

3 . The heat dissipation device of claim 2 , wherein the second vapor chamber further comprises a plurality of bumps extending outwardly from the second upper cover and the second lower cover respectively, so that one of the plurality of second openings is formed between any two of the plurality of bumps.

4 . The heat dissipation device of claim 3 , wherein the second capillary structure includes a second main capillary structure and a plurality of second sub-capillary structures, wherein the plurality of second sub-capillary structures overlap some of the plurality of bumps, and the plurality of second sub-capillary structures are connected to the second main capillary structure and in a capillary communication to the capillary layer.

5 . The heat dissipation device of claim 2 , wherein the second capillary structure is a powder sintered body or a mesh body, and the plurality of first capillary structures are strip-shaped fiber bodies.

6 . The heat dissipation device of claim 1 , wherein the plurality of first support units are cylinders.

7 . The heat dissipation device of claim 1 , wherein the first vapor chamber further comprises a plurality of pillars that are disposed on the first upper cover and located in the first chamber.

8 . The heat dissipation device of claim 1 , further comprising two annular members disposed on the first upper cover and surrounding the two first openings and the two bending portions respectively.

9 . The heat dissipation device of claim 1 , wherein an R angle formed by the two bending portions is one to two times a thickness of a plate formed by the second upper cover and the second lower cover.

10 . The heat dissipation device of claim 1 , wherein the second vapor chamber has a U-shaped cross-section.

11 . The heat dissipation device of claim 1 , further comprising a first fin set disposed between the first upper cover and the second lower cover and located between the two bending portions.

12 . The heat dissipation device of claim 1 , further comprising a second fin set disposed on the second upper cover and completely corresponding to the middle portion.