System and method for enabling high speed optical communication inside and between PC boards, 3D multi-chip modules and other electronic systems
View Patent ↗A system for carrying light signal data between points in an electronic assembly. A light signal source is mounted at a first point. The light signal source emits the light signal along a first path. A light signal detector is mounted to a second point in the electronic assembly. A metalens is set in the first path that directs said light signal toward the light signal detector. If interim substrates are disposed between the first point and the second point, features are provided that enable the light signal to pass. In addition, a metalens can redirect the light signal away from the first path, correct distortions in the light signal and/or focus the light signal toward the light signal detector.
1 . A system for transmitting a light signal carrying data between circuitry in a stacked configuration of substrates, said system comprising:
a first substrate having a first top surface and a first bottom surface;
a second substrate having a second top surface and a second bottom surface wherein said second bottom surface faces said first top surface of said first substrate;
an interim substrate interposed between said first substrate and said second substrate, wherein said interim substrate has an interim top surface that faces said second substrate and an interim bottom surface that faces said first substrate;
a light signal source mounted on said first top surface of said first substrate, wherein said light signal source emits said light signal in a wavelength range in a first direction along a first path;
a light signal detector mounted on said second top surface of said second substrate;
wherein said light signal passes through both said second substrate and said interim substrate as said light signal travels from said light signal source to said light signal detector.
2 . The system according to claim 1 , wherein both said second substrate and said interim substrate contain areas that are transparent to said wavelength range of said light signal, wherein said light signal passes through said areas as said light signal travels from said light signal source to said light signal detector.
3 . The system according to claim 1 , wherein a hole is formed in said interim substrate and said light signal passes through said hole as said light signal travels from said light signal source to said light signal detector.
4 . The system according to claim 1 , further including a metalens set in said first path that directs said light signal toward said light signal detector.
5 . The system according to claim 4 , wherein said metalens focuses said light signal toward said light signal detector.
6 . The system according to claim 1 , wherein said light signal detector is offset from said first path and wherein a metalens is affixed to said light signal source and redirects said light signal away from said first path and toward said light signal detector.
7 . The system according to claim 1 , further including a metalens set in said first path, wherein said interim substrate adds refractions and distortions to said light signal as said light signal passes through said interim substrate wherein said metalens corrects said light signal for said refractions and distortions as said light signal passes through said metalens.
8 . The system according to claim 7 , wherein said metalens is disposed between said light signal source and said first substrate.
9 . The system according to claim 7 , wherein said metalens is disposed between said light signal detector and said second substrate.