IP Library Granted Patent US 12,663,460
Granted Patent B2
US 12,663,460 · App. 18/780,499 · Granted Jun 23, 2026

Apparatus for testing electronic devices

Inventors: SeungHyeon Jeong (Chuncheon, KR); HunTaek Lee (Gyeonggi-do, KR); BumSoo Park (Seoul, KR); JiSu Lee (Incheon, KR)
G01R31/2862G01R31/2884H05K9/0088
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Quick Facts
Patent No.
US 12,663,460
App. No.
18/780,499
Granted
Jun 23, 2026
Kind
B2
Abstract

An apparatus for testing electronic devices comprises: a base platform; a cover plate disposed on the base platform, and defining with the base platform an array of test chambers and at least one gap separating the test chambers from each other, wherein the cover plate has at each of the test chambers a top opening for placing an electronic device within the test chamber and a side wall around the opening; an array of test boards each being disposed under one of the array of test chambers, wherein each test board includes a socket connectable with the electronic device placed within the test chamber for testing; and an electromagnetic absorber material disposed within the at least one gap and attached onto the cover plate to absorb electromagnetic interferences between adjacent electronic devices when they are placed within the array of test chambers for testing.

Claims (13)

1 . An apparatus for testing electronic devices, the apparatus comprising:

a base platform;

a cover plate disposed on the base platform, and defining with the base platform an array of test chambers and at least one gap separating the test chambers from each other, wherein the cover plate has at each of the test chambers a top opening for placing an electronic device within the test chamber and a side wall around the opening for separating the test chamber from the at least one gap;

an array of test boards each being disposed under one of the array of test chambers, wherein each test board includes a socket connectable with the electronic device placed within the test chamber for testing; and

an electromagnetic absorber material disposed within the at least one gap and attached onto the cover plate to absorb electromagnetic interferences between adjacent electronic devices when they are placed within the array of test chambers for testing.

2 . The apparatus of claim 1 , wherein the electromagnetic absorber material is attached onto the side walls.

3 . The apparatus of claim 1 , wherein the cover plate has a main frame where the openings are formed, and the electromagnetic absorber material is attached onto the main frame.

4 . The apparatus of claim 1 , wherein the cover plate has a main frame where the openings are formed, at least one support wall extending between the main frame and the base platform, and the electromagnetic absorber material is attached onto the at least one support wall.

5 . The apparatus of claim 4 , wherein the electromagnetic absorber material is further attached onto the side walls.

6 . The apparatus of claim 1 , wherein each of the array of test boards further comprises a connector disposed within the at least one gap and electrically coupled with the socket, and wherein the connector is configured for connecting the socket with a host device for testing the electronic devices.

7 . The apparatus of claim 1 , wherein each of the array of test boards further comprises a protection tape mounted over a connector, and the electromagnetic absorber material is attached over the protection tape.

8 . The apparatus of claim 1 , wherein the electromagnetic absorber material is in a form of tapes.

9 . The apparatus of claim 1 , wherein the electromagnetic absorber material is a laminate of metal, electromagnetic absorber and adhesive layers.