Image capturing module and electronic device
An image capturing module includes an imaging lens system, an image sensor, a first circuit board, at least three passive components, and a second circuit board. The image sensor is at an image side of the imaging lens system and having a photosensitive area corresponding to the imaging lens system. The image sensor and the passive components are disposed on the first circuit board. Each passive component has a first lead and a second lead. The second circuit board corresponds to the first circuit board and includes a connector and multiple circuits electrically connected to the connector. The first leads and the image sensor are electrically connected and disposed on the first circuit board. The second leads form a contact on the first circuit board. The number of the contact is less than the number of the passive components. The contact is electrically connected to at least one circuit.
1 . An image capturing module comprising:
an imaging lens system;
an image sensor located at an image side of the imaging lens system, and the image sensor having a photosensitive area disposed corresponding to the imaging lens system;
a first circuit board, wherein the image sensor is disposed on the first circuit board;
at least three passive components disposed on the first circuit board, and each of the at least three passive components having a first lead and a second lead; and
a second circuit board disposed corresponding to the first circuit board, and the second circuit board comprising a connector and a plurality of circuits that are electrically connected to the connector;
wherein the first leads of the at least three passive components and the image sensor are electrically connected and together disposed on the first circuit board, the second leads of the at least three passive components form at least one contact on the first circuit board, a number of the at least one contact is less than a number of the at least three passive components, and the at least one contact is electrically connected to at least one of the plurality of circuits of the second circuit board.
2 . The image capturing module of claim 1 , wherein the number of the at least one contact is one.
3 . The image capturing module of claim 1 , wherein the second leads of the at least three passive components are grounded on the first circuit board.
4 . The image capturing module of claim 3 , wherein the second circuit board further comprises a stiffener, the stiffener and the connector are disposed on opposite surfaces of the second circuit board, and the connector is disposed on a surface of the second circuit board that corresponds to the first circuit board.
5 . An electronic device comprising:
the image capturing module of claim 1 .
6 . An image capturing module comprising:
an imaging lens system;
an image sensor located at an image side of the imaging lens system, and the image sensor having a photosensitive area disposed corresponding to the imaging lens system;
a first circuit board, wherein the image sensor is disposed on the first circuit board;
at least three electronic components disposed on the first circuit board, and each of the at least three electronic components having a first lead and a second lead; and
a second circuit board disposed corresponding to the first circuit board, and the second circuit board comprises a connector and a plurality of circuits that are electrically connected to the connector;
wherein the first leads of the at least three electronic components and the image sensor are electrically connected and together disposed on the first circuit board, the second leads of the at least three electronic components form at least one contact on the first circuit board, a number of the at least one contact is less than a number of the at least three electronic components, and the at least one contact is electrically connected to at least one of the plurality of circuits of the second circuit board.
7 . The image capturing module of claim 6 , wherein the number of the at least one contact is one.
8 . The image capturing module of claim 6 , wherein the second leads of the at least three electronic components are grounded on the first circuit board.
9 . The image capturing module of claim 8 , wherein the second circuit board further comprises a stiffener, the stiffener and the connector are disposed on opposite surfaces of the second circuit board, and the connector is disposed on a surface of the second circuit board that corresponds to the first circuit board.
10 . An electronic device comprising:
the image capturing module of claim 6 .