IP Library Granted Patent US 12663710
Granted Patent B2
US 12663710 · App. 18/744,028 · Granted Jun 23, 2026

Pellicle having vent hole

Inventors: Chue San Yoo (Hsinchu, TW); Chih-Chiang Tu (Hsinchu, TW); Chien-Cheng Chen (Hsinchu, TW); Jong-Yuh Chang (Hsinchu, TW); Kun-Lung Hsieh (Hsinchu, TW); Pei-Cheng Hsu (Hsinchu, TW); Hsin-Chang Lee (Hsinchu, TW); Yun-Yue Lin (Hsinchu, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
G03F1/68G03F1/22G03F1/62G03F1/64G03F1/82G03F7/2004
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Quick Facts
Patent No.
US 12663710
App. No.
18/744,028
Granted
Jun 23, 2026
Kind
B2
Abstract

A pellicle includes a frame having an attachment surface configured to attach to a photomask, wherein the frame comprises a vent hole. The pellicle further includes a filter covering the vent hole, wherein the filter directly contacts an inner surface of the frame, and the filter extends in a direction parallel to the attachment surface. The pellicle further includes a membrane extending over a top surface of the frame.

Claims (35)

1 . A pellicle comprising:

a frame having an attachment surface configured to attach to a photomask, wherein the frame comprises a vent hole, and the vent hole comprises:

a first sidewall formed by the frame, wherein the first sidewall is angled with respect to the attachment surface;

a filter covering the vent hole, wherein the filter directly contacts an inner surface of the frame, and the filter extends in a direction parallel to the attachment surface; and

a membrane extending over a top surface of the frame.

2 . The pellicle of claim 1 , wherein the vent hole further comprises:

a second sidewall formed by the frame, wherein the second sidewall is parallel to the attachment surface.

3 . The pellicle of claim 2 , wherein the first sidewall is adjacent to an outer surface of the frame.

4 . The pellicle of claim 1 , wherein the filter is adjacent to the first sidewall.

5 . The pellicle of claim 1 , further comprising an adhesive between the membrane and the frame.

6 . The pellicle of claim 1 , wherein the membrane has a total thickness variation (TTV) of less than 10 nanometers (nm).

7 . The pellicle of claim 1 , wherein the membrane comprises multiple layers.

8 . The pellicle of claim 1 , wherein an innermost surface of the frame is perpendicular to the attachment surface.

9 . The pellicle of claim 8 , wherein the filter is outward of the innermost surface of the frame.

10 . An assembly comprising:

a photomask;

a frame having an attachment surface attached to the photomask, wherein the frame comprises a vent hole;

a filter covering the vent hole, wherein the filter directly contacts an inner surface of the frame, and the filter extends along a surface of the frame outside the vent hole, and the surface is parallel to the photomask; and

a membrane extending over a top surface of the frame.

11 . The assembly of claim 10 , wherein the filter is recessed into the frame.

12 . The assembly of claim 10 , wherein the filter is spaced from the photomask in a direction perpendicular to the photomask.

13 . The assembly of claim 10 , wherein a height of the frame positions the membrane out of focus of radiation passing through the membrane to pattern a surface of a wafer.

14 . The assembly of claim 10 , wherein the attachment surface extends below the filter.

15 . The assembly of claim 10 , wherein the vent hole comprises:

a first portion parallel to the attachment surface; and

a second portion angled with respect to the attachment surface.

16 . The assembly of claim 15 , wherein the filter is adjacent to the second portion.

17 . The assembly of claim 15 , wherein the first portion is adjacent to an outer surface of the frame.

18 . The assembly of claim 10 , wherein the membrane has a thickness of less than 50 nanometers (nm).

19 . A method comprising:

attaching a frame having an attachment surface to the photomask, wherein the frame comprises a vent hole, and the vent hole comprises a first sidewall formed by the frame, wherein the first sidewall is angled with respect to the attachment surface;

filtering particles, using a filter, to reduce the particles from an ambient environment reaching the photomask, wherein the filter covers the vent hole, and the filter directly contacts an inner surface of the frame;

positioning a membrane extending over a top surface of the frame out of focus of radiation passing through the membrane; and

patterning a wafer using the radiation.

20 . The method of claim 19 , further comprising removing the membrane from the frame.