Forming method, forming apparatus, and article manufacturing method

1 . A forming method of forming a composition on an underlying layer of a substrate by using a mold, the method including:

detecting, as an index indicating a state of the underlying layer, at least one of an intensity and a wavelength of reflected light obtained from the substrate by irradiating the substrate with light;

determining, based on the index detected in the detecting, a measurement condition for measuring a position of a mark of the substrate;

bringing the mold and the composition on the substrate into contact with each other; and

measuring, after the bringing, in a contact state in which the mold and the composition are in contact with each other, the position of the mark of the substrate under the measurement condition determined in the determining, and aligning the mold and the substrate based on a measurement result,

wherein the detecting the index indicating the state of the underlying layer and the determining the measurement condition for measuring the position of the mark of the substrate based on the detected index are performed before the bringing the mold and the composition on the substrate into contact with each other.

2 . The method according to claim 1 , wherein

in the aligning, the position of the mark of the substrate is measured based on an image obtained by capturing an image of the mark of the substrate, and

in the determining based on the index detected in the detecting, a condition under which the image of the mark of the substrate is captured, such that a luminance of the mark in the image falls within an allowable range, is determined as the measurement condition.

3 . The method according to claim 2 , wherein

the condition under which the image of the mark of the substrate is captured includes at least one of an intensity of light used to measure the position of the mark of the substrate, a wavelength thereof, and a charge accumulation period of an image capturing device configured to capture the image of the mark of the substrate.

4 . The method according to claim 1 , wherein

in the determining, the measurement condition to be used in the aligning is determined further based on information indicating a correspondence relationship between the index detected in the detecting and a condition for measuring the position of the mark of the substrate in the contact state.

5 . The method according to claim 4 , further including

generating the information by using a second substrate different from the substrate before the detecting.

6 . The method according to claim 1 , wherein

the detecting is performed with respect to each of at least two shot regions selected from a plurality of shot regions in the substrate, and

in the determining, the measurement condition is determined for each of the plurality of shot regions based on the index detected in the detecting for each of the at least two shot regions.

7 . The method according to claim 6 , further including

obtaining arrangement information of the plurality of shot regions in the substrate by detecting a mark of each of the at least two shot regions,

wherein the detecting is performed in parallel with the obtaining.

8 . The method according to claim 1 , wherein

the detecting is performed with respect to each of at least two shot regions selected from a plurality of shot regions in the substrate, and

in the determining, the measurement condition to be commonly used for the plurality of shot regions is determined based on the index detected in the detecting for each of the at least two shot regions.

9 . The method according to claim 8 , further including

obtaining arrangement information of the plurality of shot regions in the substrate by detecting a mark of each of the at least two shot regions,

wherein the detecting is performed in parallel with the obtaining.

10 . The method according to claim 1 , wherein

the state of the underlying layer includes a thickness of the underlying layer.

11 . An article manufacturing method including:

forming a composition on a substrate by using a forming method defined in claim 1 ;

processing the substrate including the composition formed in the forming; and

manufacturing an article from the substrate processed in the processing.

12 . A forming apparatus that forms a composition on an underlying layer of a substrate by using a mold, the apparatus comprising:

a detector configured to detect, as an index indicating a state of the underlying layer, at least one of an intensity and a wavelength of reflected light obtained from the substrate by irradiating the substrate with light;

a measurement device configured to measure a position of a mark of the substrate; and

a controller,

wherein the controller is configured to

cause the detector to detect the at least one of the intensity and the wavelength of the reflected light, as the index indicating the state of the underlying layer, before bringing the mold and the composition on the substrate into contact with each other,

determine, based on the index detected by the detector and before bringing the mold and the composition on the substrate into contact with each other, a measurement condition for measuring the mark of the substrate by the measurement device,

cause, after bringing the mold and the composition on the substrate into contact with each other, the measurement device to measure the mark of the substrate under the measurement condition, and

control alignment between the mold and the substrate based on a measurement result of the mark of the substrate measured under the measurement condition.