Exposure apparatus, exposure method, and article manufacturing method

1 . An exposure apparatus for projecting a pattern of an original onto a substrate by a projection optical system, and exposing the substrate, comprising:

a stage configured to move while holding the substrate;

a measurement device configured to perform, at a plurality of measurement points in an exposure region, measurement of a height position of the substrate held by the stage; and

a controller configured to control the measurement device, and correct a position of the stage based on a result of the measurement such that a shift amount of the height position with respect to an image plane of the projection optical system is decreased,

wherein

the controller is configured to set the plurality of measurement points in the exposure region based on information regarding the exposure region,

the exposure region is one region of a plurality of shot regions of the substrate,

the plurality of shot regions include a full shot region where an entire area of a pattern region of the original is transferred, and a partial shot region where only a part of the pattern region of the original is transferred, and

the controller is configured to set different measurement points between the full shot region and the partial shot region.

2 . The apparatus according to claim 1 , wherein

the controller is configured to set the plurality of measurement points in the exposure region such that one measurement point is assigned to each of a plurality of sub-regions obtained by dividing the exposure region based on one of a position and a size of the exposure region.

3 . The apparatus according to claim 2 , wherein

the controller is configured to determine the required number of measurement points based on a relationship, obtained in advance, between the number of measurement points and a correction residual by the correction for each size of the exposure region, and determine the number of divisions of the exposure region in accordance with the determined required number of measurement points.

4 . The apparatus according to claim 2 , wherein

the controller is configured to set a measurement point at a center of each of the plurality of sub-regions.

5 . The apparatus according to claim 2 , wherein the plurality of sub-regions correspond to a plurality of chip regions.

6 . The apparatus according to claim 1 , wherein

for the full shot region, the controller is configured to divide the full shot region into n equal parts in a first direction and a second direction orthogonal to the first direction, and for the partial shot region, the controller is configured to divide only a region within the substrate into n equal parts in the first direction and the second direction.

7 . The apparatus according to claim 1 , wherein

for the full shot region, the controller is configured to set a measurement point at a center of each of the plurality of sub-regions, and for the partial shot region, the controller is configured to set a measurement point at a center of each of a plurality of sub-regions in a region within the substrate.

8 . The apparatus according to claim 1 , wherein

the controller is configured to set the plurality of measurement points by selecting some of distribution measurement points uniformly distributed over an entire area of the exposure region.

9 . The apparatus according to claim 1 , wherein

the controller is configured to determine positions of the plurality of measurement points in the exposure region based on a height distribution in a sample region obtained in advance.

10 . The apparatus according to claim 9 , wherein

the controller is configured to determine, as a position of a measurement point, a position where a change amount of a height position in the height distribution is smaller than a predetermined value.

11 . The apparatus according to claim 9 , wherein

the controller is configured to determine positions of the plurality of measurement points in the exposure region based on information obtained by performing processing of obtaining a height distribution in the sample region a plurality of times.

12 . The apparatus according to claim 7 , wherein

the controller is configured to set the plurality of measurement points by selecting some of distribution measurement points uniformly distributed over an entire area of an exposure region.

13 . The apparatus according to claim 1 , wherein

the measurement device projects a pattern to an entire area of the exposure region to perform measurement of the height position of the substrate.

14 . An exposure method of projecting a pattern of an original onto a substrate by a projection optical system, and exposing the substrate, comprising:

performing, at a plurality of measurement points in an exposure region on the substrate, measurement of a height position of the substrate held by a stage;

correcting a position of the stage based on a result of the measurement such that a shift amount of the height position with respect to an image plane of the projection optical system is decreased; and

exposing the exposure region after correcting the position of the stage,

wherein

the plurality of measurement points in the exposure region are set based on information regarding the exposure region,

the exposure region is one region of a plurality of shot regions of the substrate,

the plurality of shot regions include a full shot region where an entire area of a pattern region of the original is transferred, and a partial shot region where only a part of the pattern region of the original is transferred, and

different measurement points between the full shot region and the partial shot region are set.

15 . An article manufacturing method comprising:

exposing a substrate in accordance with an exposure method defined in claim 14 ; and

developing the exposed substrate,

wherein an article is manufactured from the developed substrate.