Electronic device

1 . An electronic device comprising:

a display panel foldable about a virtual folding axis extending in a first direction; and

a support plate disposed under the display panel, the support plate including a porous substrate,

wherein the porous substrate includes:

a base material including a metal;

a first porous film disposed on the base material, the first porous film including metal oxide; and

a second porous film disposed under the base material, the second porous film including metal oxide.

2 . The electronic device of claim 1 , wherein each of the metal oxide included in the first porous film and the metal oxide included in the second porous film is oxide of the metal included in the base material.

3 . The electronic device of claim 1 , wherein each of pores in the first porous film and pores in the second porous film has a pillar shape extending in a thickness direction in a sectional view.

4 . The electronic device of claim 1 , wherein the porous substrate further includes:

a third porous film disposed between the base material and the first porous film; and

a fourth porous film disposed between the base material and the second porous film,

wherein the third porous film has a lower porosity than the first porous film, and

wherein the fourth porous film has a lower porosity than the second porous film.

5 . The electronic device of claim 4 , wherein the third porous film has a higher hardness than the first porous film, and

wherein the fourth porous film has a higher hardness than the second porous film.

6 . The electronic device of claim 4 , wherein each of the metal oxide included in the first porous film and the metal oxide included in the second porous film is oxide of the metal included in the base material, and

wherein each of the third porous film and the fourth porous film includes oxide of the metal included in the base material.

7 . The electronic device of claim 4 , wherein each of pores in the first porous film, pores in the second porous film, pores in the third porous film, and pores in the fourth porous film has a pillar shape extending in a thickness direction in a sectional view.

8 . The electronic device of claim 1 , wherein the metal included in the base material includes one of aluminum, magnesium, and titanium.

9 . The electronic device of claim 1 , wherein the support plate further includes:

first sealing agents filling pores in the first porous film; and

second sealing agents filling pores in the second porous film.

10 . The electronic device of claim 9 , wherein each of the first sealing agents and the second sealing agents includes one of a dye and an elastic material.

11 . The electronic device of claim 1 , wherein the support plate further includes:

a first cover substrate disposed on the first porous film; and

a second cover substrate disposed under the second porous film, and

wherein each of the first cover substrate and the second cover substrate includes a metal.

12 . The electronic device of claim 11 , wherein each of the first cover substrate and the second cover substrate includes stainless steel (SUS).

13 . The electronic device of claim 11 , wherein the support plate further includes:

a first adhesive support layer disposed between the first cover substrate and the first porous film; and

a second adhesive support layer disposed between the second cover substrate and the second porous film.

14 . The electronic device of claim 1 , wherein the display panel includes a folding region foldable about the folding axis and a first non-folding region and a second non-folding region spaced apart from each other in a second direction crossing the first direction with the folding region therebetween.

15 . The electronic device of claim 14 , wherein the support plate includes a first support part configured to overlap the first non-folding region, a second support part configured to overlap the second non-folding region, and a third support part configured to overlap the folding region, and

wherein the third support part defines openings penetrating the support plate from a front surface of the support plate to a rear surface of the support plate.

16 . The electronic device of claim 15 , wherein the openings are arranged in a grid form in a plan view.

17 . The electronic device of claim 14 , wherein the support plate includes a first support part configured to overlap the first non-folding region, a second support part configured to overlap the second non-folding region, and a third support part configured to overlap the folding region, and

wherein the third support part defines grooves on a rear surface of the support plate.

18 . The electronic device of claim 14 , wherein the support plate further includes a filling member including an elastic material,

wherein the porous substrate is provided in plurality, and the plurality of porous substrates include a first plate configured to overlap the first non-folding region and a second plate configured to overlap the second non-folding region and spaced apart from the first plate, and

wherein the filling member overlaps the folding region and is disposed between the first plate and the second plate.

19 . The electronic device of claim 14 , wherein the support plate further includes:

a first sealing layer disposed on the first porous film and covering the first porous film; and

a second sealing layer disposed under the second porous film and covering the second porous film, and

wherein each of the first sealing layer and the second sealing layer includes an elastic material.

20 . The electronic device of claim 19 , wherein the support plate includes a first support part configured to overlap the first non-folding region, a second support part configured to overlap the second non-folding region, and a third support part configured to overlap the folding region, and

wherein the third support part overlaps an entirety of the folding region.

21 . The electronic device of claim 16 , further comprising:

a first lower plate disposed under the support plate and configured to overlap the first non-folding region and one portion of the folding region; and

a second lower plate disposed under the support plate and configured to overlap the second non-folding region and another portion of the folding region, the second lower plate being spaced apart from the first lower plate,

wherein each of the first lower plate and the second lower plate includes:

a lower base material including a metal;

a fifth porous film disposed on the lower base material, the fifth porous film including metal oxide; and

a sixth porous film disposed under the lower base material, the sixth porous film including metal oxide.

22 . The electronic device of claim 21 , wherein each of the first lower plate and the second lower plate further includes:

a seventh porous film disposed between the lower base material and the fifth porous film; and

an eighth porous film disposed between the lower base material and the sixth porous film.

23 . The electronic device of claim 22 , wherein the seventh porous film has a higher hardness than the fifth porous film, and

wherein the eighth porous film has a higher hardness than the sixth porous film.

24 . The electronic device of claim 21 , wherein each of the first lower plate and the second lower plate further includes:

a third cover substrate disposed on the fifth porous film; and

a fourth cover substrate disposed under the sixth porous film, and

wherein each of the third cover substrate and the fourth cover substrate includes a metal.

25 . The electronic device of claim 24 , wherein each of the first lower plate and the second lower plate further includes:

a first lower adhesive layer disposed between the third cover substrate and the fifth porous film; and

a second lower adhesive layer disposed between the fourth cover substrate and the sixth porous film.

26 . The electronic device of claim 1 , further comprising:

an electronic module disposed under the display panel and at least partially inserted into a hole defined in the support plate.

27 . An electronic device comprising:

a display panel foldable about a virtual folding axis; and

a support plate disposed under the display panel, the support plate including a porous substrate,

wherein the porous substrate includes:

a base material including a metal;

a first oxide film disposed on the base material, the first oxide film defining first pores therein; and

a second oxide film disposed under the base material, the second oxide film defining second pores therein.

28 . The electronic device of claim 27 , wherein the porous substrate further includes:

a third oxide film disposed between the base material and the first oxide film, the third oxide film defining third pores therein; and

a fourth oxide film disposed between the base material and the second oxide film, the fourth oxide film defining fourth pores therein,

wherein the third oxide film has a lower porosity than the first oxide film, and

wherein the fourth oxide film has a lower porosity than the second oxide film.

29 . A method of manufacturing an electronic device comprising:

forming a support plate under a display panel foldable about a virtual folding axis extending in a first direction,

wherein the forming the support plate comprises:

forming a first porous film and a second porous film including metal oxide,

wherein in the forming the first porous film and the second porous film, the first porous film is formed on a base material and the second porous film is formed under the base material.

30 . The method of manufacturing the electronic device of claim 29 , wherein the forming the first porous film and the second porous film is performed through an anodizing process.

31 . The method of manufacturing the electronic device of claim 29 , wherein in the forming the first porous film and the second porous film, a third porous film is further formed between the base material and the first porous film, and a fourth porous film is further formed between the base material and the second porous film.

32 . The method of manufacturing the electronic device of claim 31 , wherein the forming the first porous film and the second porous film is performed through a plasma electrolytic oxidation process.