Input/output device in a high density or rackmount environment
In certain embodiments, an input/output (IO) device includes: an IO interface configured to operatively connect the IO device to one or more computing devices; a device unit operatively connected to the IO interface and comprising a plurality of IO components; an IO internal expansion unit operatively connected to the IO interface and the device unit; a management unit configured to provide remote management capabilities for the IO device; a power unit operatively connected to and configured to provide power for the IO interface, the device unit, the IO internal expansion unit; and the management unit; and a thermal unit configured to provide thermal management for the IO device.
1 . An input/output (IO) device, comprising:
an IO interface configured to operatively connect the IO device to one or more computing devices;
a device unit operatively connected to the IO interface and comprising a plurality of IO components configured to provide additional capabilities to the one or more computing devices,
wherein:
the additional capabilities comprise performing operations, transferring data, or storing data based on instructions from of the one or more computing devices,
the plurality of IO components comprises a plurality of graphics processing units (GPUs) and a plurality of Smart Network Interface Cards (SmartNICs) co-located within the IO device,
each GPU of the plurality of GPUs corresponds to a respective dedicated SmartNIC of the plurality of SmartNICs, and
each respective dedicated SmartNIC of the plurality of SmartNICs is configured to receive data for, and provide data to, a respective GPU of the plurality of GPUs to which the respective dedicated SmartNIC corresponds to be processed by the respective GPU;
an IO internal expansion unit operatively connected to the IO interface and the device unit;
a management unit configured to provide remote management capabilities for managing the IO device;
a power unit operatively connected to and configured to provide power to the IO interface, the device unit, the IO internal expansion unit; and the management unit; and
a thermal unit configured to provide thermal management for the IO device, the thermal management comprising cooling of the IO device,
wherein the IO device is a single physical device comprising the IO interface, the device unit, the IO internal expansion unit, the management unit, and the thermal unit, and is separate from any of the one or more computing devices.
2 . The IO device of claim 1 , wherein the IO interface is configured to operatively connect the IO device to the one or more computing devices using datacenter-modular hardware system (DC-MHS) standards.
3 . The IO device of claim 1 , wherein the plurality of IO components further comprises a plurality of Enterprise and Data Center Standard Form Factor (EDSFF) storage drives.
4 . The IO device of claim 1 , wherein the thermal unit comprises one or more fans.
5 . The IO device of claim 1 , wherein the thermal unit comprises an immersive cooling device.
6 . The IO device of claim 1 , wherein the thermal unit comprises a liquid cooling device.
7 . The IO device of claim 1 , wherein the plurality of IO components further comprises a plurality of memory devices configured to communicate with the one or more computing devices using a compute express link (CXL) interconnect.
8 . The IO device of claim 1 , wherein the IO device is co-located in a computing device rack with at least one of the one or more computing devices.
9 . A system, comprising:
a computing device; and
an input/output (IO) device, comprising:
an IO interface operatively connected to the computing device;
a device unit operatively connected to the IO interface and comprising a plurality of IO components configured to provide additional capabilities to the computing device,
wherein:
the additional capabilities comprise performing operations, transferring data, or storing data based on instructions from of the computing device,
the plurality of IO components comprises a plurality of graphics processing units (GPUs) and a plurality of Smart Network Interface Cards (SmartNICs) co-located within the IO device,
each GPU of the plurality of GPUs corresponds to a respective dedicated SmartNIC of the plurality of SmartNICs, and
each respective dedicated SmartNIC of the plurality of SmartNICs is configured to receive data for, and provide data to, a respective GPU of the plurality of GPUs to which the respective dedicated SmartNIC corresponds to be processed by the respective GPU;
an IO internal expansion unit operatively connected to the IO interface and the device unit;
a management unit configured to provide remote management capabilities for managing the IO device;
a power unit operatively connected to and configured to provide power to the IO interface, the device unit, the IO internal expansion unit; and the management unit; and
a thermal unit configured to provide thermal management for the IO device, the thermal management comprising cooling of the IO device,
wherein the IO device is a single physical device comprising the IO interface, the device unit, the IO internal expansion unit, the management unit, and the thermal unit, and is separate from any of the one or more computing devices.
10 . The IO device of claim 9 , wherein the IO interface is configured to operatively connect the IO device to the computing device using datacenter-modular hardware system (DC-MHS) standards.
11 . The IO device of claim 9 , wherein the plurality of IO components further comprises a plurality of Enterprise and Data Center Standard Form Factor (EDSFF) storage drives.
12 . The IO device of claim 9 , wherein the thermal unit comprises one or more fans.
13 . The IO device of claim 9 , wherein the thermal unit comprises an immersive cooling device.
14 . The IO device of claim 9 , wherein the thermal unit comprises a liquid cooling device.
15 . The IO device of claim 9 , wherein the plurality of IO components further comprises a plurality of memory devices configured to communicate with the computing device using a compute express link (CXL) interconnect.
16 . The system of claim 9 , wherein the computing device and the IO device are co-located in a computing device rack.