Method for producing a smart card inlay, smart card inlay and smart card

1 . A method for producing a smart card inlay, the method comprising:

introducing an antenna wire into a surface of a carrier having an opening, wherein the antenna wire comprises metal having an insulation coating, and wherein the antenna wire spans the opening;

pinching the antenna wire in the opening such that a partial region of the metal of the antenna wire is stripped of the insulation coating; and

soldering the insulation coating-stripped partial region of the metal of the antenna wire with a metallic contact region of a smart card module that has been introduced into the opening of the carrier.

2 . The method as claimed in claim 1 , furthermore comprising:

cleaning the insulation coating-stripped partial region of the metal before soldering.

3 . The method as claimed in claim 1 ,

wherein during pinching a thickness of the insulation coating-stripped partial region of the metal of the antenna wire is reduced.

4 . The method as claimed in claim 1 ,

wherein during pinching a plurality of partial regions of the metal of the antenna wire are stripped of the insulation coating.

5 . The method as claimed in claim 1 ,

wherein the opening is a through opening.

6 . The method as claimed in claim 1 , further comprising:

introducing the smart card module into the opening.

7 . The method as claimed in claim 6 ,

wherein the smart card module is introduced into the opening from an opposite side of the carrier with respect to an antenna side.

8 . The method as claimed in claim 1 ,

wherein the partial region is offset vertically during the pinching of the wire.

9 . The method as claimed in claim 8 ,

wherein the smart card module is introduced into the opening from an antenna side of the carrier.

10 . The method as claimed in claim 8 ,

wherein the insulation-stripped partial region of the metal that is to be soldered is structured or roughened during pinching.

11 . The method as claimed in claim 1 , wherein during pinching a thickness of the insulation coating-stripped partial region of the metal of the antenna wire is reduced to 30%-60% of a thickness of the antenna wire in non-pinched regions.

12 . The method as claimed in claim 1 , wherein both ends of the antenna wire span the opening.

13 . A smart card inlay, comprising:

a carrier having an opening;

an antenna wire arranged in a surface of the carrier, wherein the antenna wire comprises metal having an insulating coating, wherein the antenna wire spans the opening, and wherein a partial region of the metal of the antenna wire in the opening is stripped of insulation by means of pinching; and

a smart card module having a metallic contact region, wherein the smart card module is arranged in the opening of the carrier, and wherein the insulation-stripped partial region of the metal of the antenna wire is soldered with the metallic contact region of the smart card module.

14 . The smart card inlay as claimed in claim 13 ,

wherein in the pinched partial region, a thickness of the antenna wire amounts to 30%-60% of the thickness of the antenna wire in non-pinched regions.

15 . The smart card inlay as claimed in claim 13 ,

wherein the opening is a through opening.

16 . The smart card inlay as claimed in claim 13 ,

wherein inside the opening the antenna wire runs on the same side of the smart card inlay as outside the opening.

17 . The smart card inlay as claimed in claim 13 ,

wherein inside the opening the antenna wire runs on an opposite side of the smart card inlay with respect to the side of the smart card inlay on which the antenna wire is arranged.

18 . The smart card inlay as claimed in claim 13 ,

wherein a thickness of the smart card inlay is less than 180 μm.

19 . A smart card, comprising:

a smart card inlay as claimed in claim 13 ; and

a smart card body, wherein the smart card inlay is embedded in the smart card body.

20 . The smart card inlay as claimed in claim 13 , wherein both ends of the antenna wire span the opening.